Atjaunināt sīkdatņu piekrišanu

Advancements in Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3: Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics 2020 ed. [Mīkstie vāki]

Edited by , Edited by , Edited by , Edited by , Edited by , Edited by , Edited by , Edited by
  • Formāts: Paperback / softback, 129 pages, height x width: 279x210 mm, weight: 454 g, 95 Illustrations, color; 18 Illustrations, black and white; VIII, 129 p. 113 illus., 95 illus. in color., 1 Paperback / softback
  • Sērija : Conference Proceedings of the Society for Experimental Mechanics Series
  • Izdošanas datums: 04-Jan-2021
  • Izdevniecība: Springer Nature Switzerland AG
  • ISBN-10: 3030300110
  • ISBN-13: 9783030300111
  • Mīkstie vāki
  • Cena: 180,78 €*
  • * ši ir gala cena, t.i., netiek piemērotas nekādas papildus atlaides
  • Standarta cena: 212,69 €
  • Ietaupiet 15%
  • Grāmatu piegādes laiks ir 3-4 nedēļas, ja grāmata ir uz vietas izdevniecības noliktavā. Ja izdevējam nepieciešams publicēt jaunu tirāžu, grāmatas piegāde var aizkavēties.
  • Daudzums:
  • Ielikt grozā
  • Piegādes laiks - 4-6 nedēļas
  • Pievienot vēlmju sarakstam
  • Formāts: Paperback / softback, 129 pages, height x width: 279x210 mm, weight: 454 g, 95 Illustrations, color; 18 Illustrations, black and white; VIII, 129 p. 113 illus., 95 illus. in color., 1 Paperback / softback
  • Sērija : Conference Proceedings of the Society for Experimental Mechanics Series
  • Izdošanas datums: 04-Jan-2021
  • Izdevniecība: Springer Nature Switzerland AG
  • ISBN-10: 3030300110
  • ISBN-13: 9783030300111
Advancement of Optical Methods & Digital Image Correlation in Experimental Mechanics, Volume 3 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the third volume of six from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas: 


DIC Methods & Its Applications
Photoelsticity and Interferometry Applications
Micro-Optics and Microscopic Systems
Multiscale and New Developments in Optical Methods
DIC and its Applications for Inverse Problems

1. Digital Projection Speckle Technique for Fringe Generation.-
2.
Quantifying Wrinkling During Tow Placement On Curvilinear Paths.-
3.
Experimental Mechanics, Tool to Verify Continuum Mechanics Predictions.-
4.
Study the Deformation of Solid Cylindrical Specimens under Torsion using 360o
DIC.-
5. Mutiscale XCT Scans to Study Damage Mechanism in Syntactic Foam.-
6.
An Investigation of Digital Image Correlation Technique for Earth Materials.-
7. Dynamics of Deformation-to-Fracture Transition Based on Wave Theory.-
8.
Fatigue Monitoring of Dented Pipeline Specimens using Infrared Thermography,
DIC and Fiber Optic Strain Gages.-
9. Development of Optical Technique for
Measuring Kinematic Fields in Presence of Cracks, FIB-SEM-DIC.-
10. DIC
Determination of SIF in Orthotropic Composite.-
11. Determining In-plane
Displacement by Combining DIC Method and Plenoptic Camera Built-in Changing
Focal Distance Function.-
12. Identification of Interparticle Contacts in
Granular Media using Mechanoluminescent Material.-
13. Color Transfer in
Twelve Fringe Photoelasticity (TFP).-
14. Infrared Deflectometry.-
15.
Real-time Shadow Moiré Measurement by Two Light Sources.-
16. Study of MRI
Compatible Piezoelectric Motor by Finite Element Modeling and High-Speed
Digital Holography.-
17. Digital Volume Correlation: Progress and
Challenges.-
18. Development of Camera Calibration-free 3D Shape Measurement
Using Feature Quantity Type Whole-Space Tabulation Method.-
19. Temporal
Phase Unwrapping for High-Speed Holographic Shape Measurements of
Geometrically Discontinuous Objects.-
20. Projection-based Measurement and
Identification.
Ming-Tzer Lin - National Chung Hsing University, Taiwan; Cesar Sciammarella - Illinois Institute of Technology, USA; Horacio D. Espinosa- Northwestern University, USA;  Cosme Furlong - Worcester Polytechnic Institute, USA; Luciano Lamberti- Politecnico di Bari, Italy; Phillip Reu- Sandia National Laboratories, Albuquerque, NM, USA; Michael Sutton- University of South Carolina, Columbia, SC, USA; C-H. Hwang-Instrument Technology Research Center, Taiwan