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E-grāmata: Electronic Packaging Materials and Their Properties [Taylor & Francis e-book]

(University of Maryland, College Park, USA), (DE Corp, Kokomo, Indiana, USA), (Consultant, Hillsboro, Oregon, USA), (University of Maryland, College Park,), (Shiraz University, Shiraz, Iran), (University of Maryland, College Park, USA)
  • Formāts: 120 pages, 61 Tables, black and white
  • Sērija : Electronic Packaging
  • Izdošanas datums: 18-Dec-1998
  • Izdevniecība: CRC Press Inc
  • ISBN-13: 9781315214153
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  • Taylor & Francis e-book
  • Cena: 231,23 €*
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  • Standarta cena: 330,33 €
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Electronic Packaging Materials and Their PropertiesPalielināt
  • Formāts: 120 pages, 61 Tables, black and white
  • Sērija : Electronic Packaging
  • Izdošanas datums: 18-Dec-1998
  • Izdevniecība: CRC Press Inc
  • ISBN-13: 9781315214153
Citas grāmatas par šo tēmu:
Taylor & Francis e-booksMore info about Taylor & Francis e-books
Rokasgrāmatas mājas lapa: https://www.taylorfrancis.com/books/9781315214153
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Preface 1(2)
1 Properties of electronic packaging materials
3(18)
1.1 Electrical properties
3(6)
1.2 Thermal and thermomechanical properties
9(4)
1.3 Mechanical properties
13(4)
1.4 Chemical properties
17(3)
1.5 Miscellaneous properties
20(1)
2 Zeroth-level packaging materials
21(18)
2.1 Semiconductors
21(4)
2.2 Attachment materials
25(5)
2.3 Substrates materials
30(9)
3 First-level packaging materials
39(18)
3.1 Wire interconnects
39(5)
3.2 Tape interconnects
44(3)
3.3 Case materials
47(3)
3.4 Lid seals
50(4)
3.5 Leads
54(3)
4 Second-level packaging materials
57(32)
4.1 Reinforcement fiber materials
57(5)
4.2 Resins
62(4)
4.3 Laminates
66(9)
4.4 Constraining cores
75(1)
4.5 Flexible wiring board materials
76(8)
4.6 Conformal coatings
84(5)
5 Third-level packaging materials
89(14)
5.1 Backpanel materials
89(1)
5.2 Connector materials
89(9)
5.3 Cables and flex circuit materials
98(5)
6 Summary
103(2)
Appendix A 105(2)
Appendix B 107(2)
References 109(4)
Index 113


Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
Permanent link: https://www.kriso.lv/db/9781315214153_pe.html
Keywords: