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Electronic Packaging Reliability: 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 [Mīkstie vāki]

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  • Formāts: Paperback / softback, 140 pages, height: 230 mm
  • Izdošanas datums: 30-Nov-1993
  • Izdevniecība: American Society of Mechanical Engineers
  • ISBN-10: 0791810356
  • ISBN-13: 9780791810354
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  • Mīkstie vāki
  • Cena: 52,11 €
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Electronic Packaging Reliability: 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November  28-December 3, 1993
  • Formāts: Paperback / softback, 140 pages, height: 230 mm
  • Izdošanas datums: 30-Nov-1993
  • Izdevniecība: American Society of Mechanical Engineers
  • ISBN-10: 0791810356
  • ISBN-13: 9780791810354
Citas grāmatas par šo tēmu:
Papers from the ASME Winter Annual Meeting (New Orleans, November 28-December 3, 1993) disseminate state-of-the-art information pertaining to activities being conducted in mechanical engineering associated with the design, manufacture, and test of reliable electronic components and systems. Topics include failure analysis and modeling, materials selection, and new concepts in theoretical, applied, and experimental investigations. No index. Annotation copyright Book News, Inc. Portland, Or.