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EMC for Systems and Installations [Mīkstie vāki]

, (Elmac Services, Wareham, UK)
  • Formāts: Paperback / softback, 312 pages, height x width: 234x156 mm, weight: 510 g, Approx. 150 illustrations; Illustrations, unspecified
  • Izdošanas datums: 06-Dec-1999
  • Izdevniecība: Newnes (an imprint of Butterworth-Heinemann Ltd )
  • ISBN-10: 0750641673
  • ISBN-13: 9780750641678
  • Mīkstie vāki
  • Cena: 95,03 €
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  • Formāts: Paperback / softback, 312 pages, height x width: 234x156 mm, weight: 510 g, Approx. 150 illustrations; Illustrations, unspecified
  • Izdošanas datums: 06-Dec-1999
  • Izdevniecība: Newnes (an imprint of Butterworth-Heinemann Ltd )
  • ISBN-10: 0750641673
  • ISBN-13: 9780750641678
This is a guide for system designers and installers faced with the day-to-day issues of achieving EMC (electromagnetic compatibility). All areas of installation EMC are covered with particular emphasis on cabling and earthing. The book is presented in two parts: the first is non-technical, and looks at the role of EMC in the context of systems and installations, with a chapter on the management aspects of EMC. The second part covers the technical aspects of EMC, looking at the various methods for ensuring compatibility. It is intended for students, managers, and technical staff. Annotation c. Book News, Inc., Portland, OR (booknews.com)

This is a guide for the system designers and installers faced with the day-to-day issues of achieving EMC, and will be found valuable across a wide range of roles and sectors, including process control, manufacturing, medical, IT and building management. The EMC issues covered will also make this book essential reading for product manufacturers and suppliers - and highly relevant for managers as well as technical staff.

The authors' approach is thoroughly practical - all areas of installation EMC are covered, with particular emphasis on cabling and earthing. Students on MSc and CPD programmes will also find in this book some valuable real-world antidotes to the academic treatises.

The book is presented in two parts: the first is non-technical, and looks at the need for EMC in the context of systems and installations, with a chapter on the management aspects of EMC. The second part covers the technical aspects of EMC, looking at the various established methods which can be applied to ensure compatibility, and setting these in the context of the new responsibilities facing system builders.


EMC for Systems and Installations is designed to complement Tim Williams' highly successful EMC for Product Designers.

Practical guide to EMC design issues for those involved in systems design and installation.
Complementary title to Williams' bestselling EMC for Product Designers.
Unique guidance for installers on EMC topics.

Recenzijas

"...contains all the fundamental information necessary for designing equipment and systems to meet the EMC requirements." --Tony Waldron, Cadac Sound+

Papildus informācija

Practical guide to EMC design issues for those involved in systems design and installation. Complementary title to Williams' bestselling EMC for Product Designers. Unique guidance for installers on EMC topics.
Preface xi
Introduction: the EMC needs of systems
1(12)
The definition of electromagnetic compatibility
2(6)
A description of EMC phenomena
3(5)
The need for EMC
8(5)
Control of emissions
8(1)
Control of immunity
9(2)
Safety aspects
11(2)
The EMC Directive's requirements for systems and installations
13(30)
Introduction to the EMC Directive
13(7)
Scope and purpose
14(3)
Other CE marking directives
17(1)
The meaning of the CE Mark
18(2)
Applicability to systems and installations
20(9)
The 1997 guidelines
20(6)
Definitions of systems and installations
26(1)
The ``responsible person''
27(1)
The ``instructions for use''
28(1)
Routes to compliance
29(9)
Self certification to standards
29(2)
Using the Technical Construction File
31(3)
Does ``CE + CE = CE?''
34(3)
The ``Procedural Approach'' to compliance
37(1)
Enforcement and the future of the EMC Directive
38(5)
The UK situation
38(1)
Other countries
38(2)
The SLIM initiative
40(3)
Management of systems EMC
43(24)
The EMC control plan
43(6)
The EMC control board
43(1)
Identifying EMC issues
44(3)
Identifying and sourcing critical parts
47(1)
Control of assembly and installation
48(1)
The EMC test plan
49(3)
Defining the configuration to be tested
49(1)
Defining the tests to be done
50(1)
Testing system modules
50(1)
Testing the whole system
50(2)
Documentation
52(1)
Documentation for in-house use
52(1)
Documentation for a TCF
52(1)
Purchasing
52(10)
Determining the EMC specifications for an incorporated item
53(3)
Checking suppliers' evidence of EMC performance
56(6)
Maintenance, upgrades and enhancements
62(2)
Maintenance
62(1)
The relevance of upgrades or enhancements
63(1)
Training
64(3)
Training and awareness check list
64(3)
Interference sources, victims and coupling
67(34)
Phenomena in the electromagnetic environment
67(11)
Examples of radiated field threats
76(1)
Continuous radiated threats from radio transmitters
77(1)
Coupling
78(14)
Direct coupling
78(3)
Near field (inductive and capacitive) coupling
81(3)
Radiated coupling
84(2)
The modes of coupling
86(3)
Protection measures
89(3)
Mains harmonics
92(4)
Their causes and problems
92(3)
Harmonic solutions
95(1)
EMC versus safety
96(5)
Filter problems
97(2)
Screened enclosures
99(2)
Earthing and bonding
101(32)
The concept and practice of earth
101(11)
The purposes of the earth connection
101(2)
Definitions of the EMC earth
103(3)
Earthing techniques
106(6)
The impedance of the earth connection
112(11)
Impedance of wires
112(3)
Effective bonding of joints
115(8)
Creating the meshed facility earth
123(10)
Constructing SRPPs and bonding mats for system blocks
123(3)
Improving the earth-bonding of older buildings
126(5)
Maintaining earth-bonding networks
131(1)
Non-IT installations
131(2)
Cabinets, cubicles and chambers
133(22)
The purpose of a metallic enclosure
133(4)
Transfer impedance of the earth reference
133(1)
Layout and placement within the enclosure
134(3)
Shielding theory
137(7)
Shielding effectiveness
137(4)
The effect of apertures, seams and penetrations
141(3)
Shielding techniques
144(7)
Bonding structural components
144(1)
Shielding hardware
145(6)
Installation and maintenance of screened enclosures
151(1)
Architectural shielding
151(4)
Apertures
152(3)
Cabling
155(38)
Coupling to, from and within cables
155(9)
Differential mode
155(4)
Common mode
159(4)
Crosstalk
163(1)
Cable screening techniques
164(11)
Options for cable screening
164(2)
Cable transfer impedance
166(2)
Terminating the screen
168(3)
Which end to earth?
171(4)
Unscreened cables
175(4)
Twisted pair
176(2)
Ribbon cable
178(1)
Installing cable systems
179(14)
Cable classification
179(5)
Segregation and routing
184(4)
Parallel Earth Conductor (PEC) techniques
188(5)
Filtering
193(18)
Attenuating noise at the interfaces
193(7)
The low pass filter
193(1)
Differential versus common mode in filters
194(1)
Source and load impedances
195(2)
Layout and installation
197(3)
Mains filters
200(5)
The operation of standard mains filters
201(1)
Extending the performance of standard filters
202(3)
Filtering other lines
205(6)
Filtered connector adaptors
206(1)
Using ferrites
207(4)
Lightning and surge protection
211(24)
The EMC problems of lightning
211(3)
How lightning phenomena can affect electronic apparatus
211(2)
Overview of design of a lightning protection system (LPS)
213(1)
Basic LPS design for safety and structural protection
214(6)
Risk assessment
214(1)
Construction of an LPS
215(4)
Bonding external cables and metallic services to earth
219(1)
Additional LPS measures to protect electronic apparatus
220(15)
Enhancing the LPS structure
221(1)
Protection of exposed equipment
221(1)
Enhanced earthing and bonding
222(3)
Cable routing and screen bonding
225(1)
Use of isolation techniques and fibre-optics
226(1)
Zoning and surge protection
226(7)
Protecting from non-lightning surges
233(2)
In situ testing
235(40)
Emissions
235(22)
CISPR instrumentation and transducers
235(11)
Conducted test methods
246(3)
Radiated test methods
249(4)
Practical aspects of in-situ emissions tests
253(4)
Immunity
257(18)
Practical aspects of immunity tests
257(1)
Electrostatic discharge
257(4)
Electrical fast transient bursts
261(3)
Surges
264(2)
Radiated and conducted RF
266(9)
Appendix A Systems EMC procedures checklist 275(4)
Company Procedures
275(1)
Designers
275(1)
Assemblers
276(1)
User and Installation Manuals
276(1)
Installation, commissioning, service
277(2)
Appendix B Determining performance criteria 279(6)
Appendix C Some published case studies 285(8)
Segaworld
285(1)
Air Traffic Services
286(3)
VDU image problems in a steel rolling mill
289(1)
Large explosion at the Texaco Refinery, Milford Haven, July 1994
290(1)
Wide area interference created by large inverter drives
291(1)
Release of chlorine gas in semiconductor processing plant
292(1)
Traction current interference to safety circuits
292(1)
Appendix D The EU and EEA countries 293(2)
The European Union
293(1)
The European Economic Area
293(2)
Glossary 295(2)
Bibliography 297(10)
Index 307


Tim Williams worked for a variety of companies as an electronic design engineer, before startinghis own consultancy specializing in EMC design and test advice and training. He has monitored the progress of the EMC Directive and its associated standards since it was first made public, over the last 25 years.