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1 Basic Principles of a Silicon Detector |
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1 | (134) |
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1.1 Fundamental Silicon Properties |
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1 | (20) |
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1.1.1 Just Silicon and Some Impurities |
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3 | (5) |
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8 | (9) |
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17 | (3) |
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1.1.4 Summary of Silicon Properties |
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20 | (1) |
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1.2 Ingredients to Use Silicon as Detector Basis |
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21 | (2) |
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1.3 Working Principle of a Silicon Tracking Device |
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23 | (15) |
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1.3.1 Charge Collection --- An Illustration |
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25 | (2) |
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1.3.2 Signal via Induction --- Shockley---Ramo Theorem |
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27 | (4) |
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1.3.3 Signal Charge and Particle Position |
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31 | (4) |
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1.3.4 n-Side Isolation of an n-in-n or n-in-p Sensors |
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35 | (3) |
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1.4 Single-Sided --- Double-Sided, Double Metal |
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38 | (3) |
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41 | (3) |
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44 | (16) |
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45 | (2) |
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1.6.2 Bias-, Guard- and Outside Protection Rings |
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47 | (3) |
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1.6.3 Design of Strip Parameters |
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50 | (10) |
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1.7 Practical Aspects of Handling and Testing Silicon Strip Devices |
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60 | (4) |
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1.7.1 What Is the Standard/Exhaustive Set of Quality Assurance Tests? |
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61 | (3) |
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1.8 R&D Methods and Tools: DLTS, TSC, TCT, Edge TCT, TPA-TCT, SIMS and Simulation |
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64 | (17) |
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1.8.1 Deep Level Transient Spectroscopy --- DLTS |
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65 | (4) |
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1.8.2 Thermally Stimulated Current --- TSC |
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69 | (2) |
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1.8.3 Transient Current Technique --- TCT |
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71 | (8) |
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1.8.4 Secondary Ion Mass Spectrometry --- SIMS |
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79 | (1) |
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80 | (1) |
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1.9 Production of Silicon Sensors |
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81 | (14) |
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1.9.1 From Pure Sand to Detector Grade Silicon |
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82 | (2) |
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84 | (9) |
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93 | (2) |
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1.10 Readout Electronics --- Strip ASICs |
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95 | (7) |
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1.11 Readout Electronics --- Pixel Readout Chips --- ROCs |
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102 | (4) |
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1.11.1 Chip Developments for the Future |
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106 | (1) |
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1.12 Other Silicon Detector Types |
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106 | (21) |
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1.12.1 Hybrid Pixels --- An Alternative with a High Number of Channels |
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107 | (1) |
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1.12.2 CMOS Detectors --- Monolithic Active Pixels --- MAPS |
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107 | (3) |
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1.12.3 Silicon on Insulator Detector --- SOI |
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110 | (2) |
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1.12.4 HV --- CMOS/HR --- CMOS |
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112 | (4) |
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1.12.5 Silicon Drift Detector |
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116 | (1) |
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1.12.6 Depleted Field Effect Transistors DEPFET Detectors |
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117 | (1) |
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1.12.7 3D Silicon Detectors |
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118 | (5) |
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1.12.8 Low Gain Avalanche Detectors --- LGAD |
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123 | (4) |
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1.12.9 Technology Advantage --- Disadvantage --- Usage |
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127 | (1) |
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1.13 Some Last Words About the Design of Detectors for High Energy Physics |
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127 | (1) |
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1.14 Some Always Unexpected Problems Along the Way |
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127 | (8) |
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2 Radiation Damage in Silicon Detector Devices |
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135 | (32) |
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135 | (13) |
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2.1.1 Damage by Particles |
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136 | (7) |
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2.1.2 Annealing --- Diffusion of Defects |
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143 | (5) |
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2.2 Defect Analysis, New Materials and Detector Engineering |
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148 | (16) |
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2.2.1 Study of Microscopic Defects and Their Impact on Macroscopic Parameters |
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150 | (3) |
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2.2.2 Different Materials and Different Radiation Types --- NIEL Violation |
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153 | (3) |
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156 | (4) |
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2.2.4 Sensors After Very High Radiation Levels |
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160 | (2) |
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2.2.5 Charge Amplification |
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162 | (2) |
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164 | (3) |
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3 First Steps with Silicon Sensors: NA11 (Proof of Principle) |
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167 | (6) |
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3.1 From Semiconductor Detectors in the 1950s as Spectroscopes to First Tracking Devices in the 1980s |
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167 | (1) |
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3.2 Development of the First Silicon Strip Detector for High Energy Physics NA11 and NA32 |
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168 | (3) |
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3.3 Distinguish c Quarks from Others |
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171 | (2) |
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4 The DELPHI Microvertex Detector at LEP |
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173 | (22) |
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4.1 Design and Strategies |
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173 | (4) |
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4.2 The DELPHI Microvertex Detector 1996/1997 |
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177 | (6) |
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4.3 The Silicon Sensors of the DELPHI Microvertex Detector MVD |
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183 | (5) |
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4.4 Implementation of Silicon Labs in Universities to Build a Large Device |
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188 | (1) |
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4.5 Physics with the DELPHI Microvertex Detector |
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189 | (6) |
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5 CDF: The World's Largest Silicon Detector in the 20th Century; the First Silicon Detector at a Hadron Collider |
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195 | (24) |
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5.1 Historical Evolution of the CDF Vertex Detector |
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195 | (5) |
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5.2 Design, How to Cover |η ≤ 2| Without Endcap |
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200 | (10) |
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200 | (10) |
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5.3 Six Inch, a New Technology Step for Large Silicon Applications |
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210 | (4) |
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5.4 Lessons Learned from Operation |
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214 | (2) |
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5.5 The t Discovery, CP Violation in the b Quark Sector |
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216 | (3) |
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6 CMS: Increasing Size by 2 Orders of Magnitude |
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219 | (72) |
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6.1 The CMS Pixel Detector --- Phase 0 --- 2008 --- 2016 |
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222 | (3) |
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6.2 The Pixel Phase I Upgrade --- Installed February/March 2017 |
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225 | (6) |
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6.3 The CMS Silicon Strip Tracker --- SST |
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231 | (8) |
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6.4 Design, How to Survive 10 Years in the Radiation Environment of LHC |
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239 | (10) |
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6.4.1 Electronics --- Quarter Micron Technology |
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239 | (1) |
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240 | (9) |
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6.5 Construction Issues for Large Detector Systems with Industry Involvement |
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249 | (8) |
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6.5.1 Quality Assurance and Problems During the Process |
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250 | (3) |
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253 | (4) |
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6.6 Tracker Operation and Performance |
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257 | (25) |
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6.6.1 Lessons Learned from Operation and Maintenance |
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257 | (3) |
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6.6.2 Signal Processing, Some Key Figures and Tracking with the CMS Tracker |
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260 | (22) |
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6.7 Physics with the CMS Tracker and High-Level Trigger |
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282 | (9) |
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7 The Design of the CMS Upgrade Tracker and the CMS High Granularity Forward Calorimeter Equipped with Silicon Sensors for the HL-LHC |
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291 | (40) |
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7.1 The CMS Tracker Upgrade for the HL-LHC --- Phase II |
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293 | (26) |
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7.1.1 Sensors for the HL-LHC CMS Tracker |
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307 | (12) |
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7.2 The CMS Endcap Calorimeter Upgrade for the HL-LHC |
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319 | (12) |
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8 Continuing the Story: Detectors for a Future Linear Collider ILC or a Future Circular Collider FCC |
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331 | (10) |
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8.1 A Silicon Tracker for the International Linear Collider --- ILC |
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333 | (4) |
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8.2 The Next Big Future Circular Collider --- FCC |
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337 | (4) |
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341 | (2) |
Appendix A Glossary |
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343 | (6) |
Appendix B Some Additional Figures |
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349 | (8) |
References |
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357 | (14) |
Index |
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371 | |