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Fundamentals and Applications of Ultrasonic Waves 2nd edition [Hardback]

(Victoria, British Columbia, Canada)
  • Formāts: Hardback, 504 pages, height x width: 254x178 mm, weight: 1020 g, 22 Tables, black and white; 161 Illustrations, black and white
  • Izdošanas datums: 25-Jun-2012
  • Izdevniecība: CRC Press Inc
  • ISBN-10: 1439854947
  • ISBN-13: 9781439854945
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Fundamentals and Applications of Ultrasonic Waves 2nd editionPalielināt
  • Formāts: Hardback, 504 pages, height x width: 254x178 mm, weight: 1020 g, 22 Tables, black and white; 161 Illustrations, black and white
  • Izdošanas datums: 25-Jun-2012
  • Izdevniecība: CRC Press Inc
  • ISBN-10: 1439854947
  • ISBN-13: 9781439854945
Citas grāmatas par šo tēmu:
Permanent link: https://www.kriso.lv/db/9781439854945.html
Keywords:
"Designed specifically for newcomers to the field, this fully updated second edition begins with fundamentals and quickly advances beyond general wave concepts into an in-depth treatment of ultrasonic waves in isotropic media. Focusing on the physics of acoustic waves, their propagation, technology, and applications, this accessible overview of ultrasonics includes accounts of viscoelasticity and multiple scattering. It examines new technologies, including atomic force acoustic microscopy, lasers, micro-acoustics, and nanotechnology. In addition, it highlights both direct and indirect applications in neighboring disciplines"--

"Preface to the Second Edition Almost exactly ten years have passed since the submission of the manuscript for the first edition of Fundamentals and Applications of Ultrasonic Waves and it is only human to think back on that occasion. At that time I was director of an ultrasonics research group and very much in the "thick of things" regarding external relations and international collaborations, including active participation in the IEEE ultrasonics symposia. There were a lot of advantages: interesting colleagues to converse with, daily access to new results, both from my research group and from the current literature, continual feedback from external groups, and so on. All of this kept me fully abreast of the latest detailed developments in research areas of personal interest in ultrasonics, together with general input on what was going on in related areas. Following that period, I retired from university research to become fully involved in a spinoff company, Microbridge Technologies Inc., which had I co-founded and whose vocation was in developing microelectronic components for sensing devices. This experience gave me access to an industrial viewpoint of MEMS devices and sensor applications, as well as a different perception of the meaning of the word "urgent." Today the situation is very different. Following my retirement from Microbridge I have been leading a rural lifestyle far removed from both university research and industrial microelectronics. The detailed contacts are gone, but occasional discussions with ex-colleagues, and the time to reflect on more general things have provided something else, which can be described as a clearer view of the big picture"--



Written at an intermediate level in a way that is easy to understand, Fundamentals and Applications of Ultrasonic Waves, Second Edition provides an up-to-date exposition of ultrasonics and some of its main applications. Designed specifically for newcomers to the field, this fully updated second edition emphasizes underlying physical concepts over mathematics.

The first half covers the fundamentals of ultrasonic waves for isotropic media. Starting with bulk liquid and solid media, discussion extends to surface and plate effects, at which point the author introduces new modes such as Rayleigh and Lamb waves. This focus on only isotropic media simplifies the usually complex mathematics involved, enabling a clearer understanding of the underlying physics to avoid the complicated tensorial description characteristic of crystalline media.

The second part of the book addresses a broad spectrum of industrial and research applications, including quartz crystal resonators, surface acoustic wave devices, MEMS and microacoustics, and acoustic sensors. It also provides a broad discussion on the use of ultrasonics for non-destructive evaluation. The author concentrates on the developing area of microacoustics, including exciting new work on the use of probe microscopy techniques in nanotechnology.

Focusing on the physics of acoustic waves, as well as their propagation, technology, and applications, this book addresses viscoelasticity, as well as new concepts in acoustic microscopy. It updates coverage of ultrasonics in nature and developments in sonoluminescence, and it also compares new technologies, including use of atomic force acoustic microscopy and lasers. Highlighting both direct and indirect applications for readers working in neighboring disciplines, the author presents particularly important sections on the use of microacoustics and acoustic nanoprobes in next-generation devices and instruments.

Recenzijas

"balances elementary introduction and advanced application; his discussion of advanced application extends to current research in theoretical and experimental ultrasonics. wherever possible Cheeke uses qualitative models to elucidate complex concepts he has derived mathematically but whose full physical implications may be opaque to the neophyte. In introducing ultrasonic measurement techniques, he enumerates the steps and methods -- and also the pitfalls that await the unsuspecting novice." -- Physics Today, April 2003

Preface to the Second Edition xv
Acknowledgments xvii
About the Author xix
Chapter 1 Ultrasonics: An Overview 1(12)
1.1 Introduction
1(2)
1.2 Ultrasonics in Nature
3(3)
1.3 Historical Development
6(1)
1.4 Physical Acoustics
7(1)
1.5 Low-Frequency Bulk Acoustic Wave Applications
8(1)
1.6 Surface Acoustic Waves
9(1)
1.7 Piezoelectric Materials
9(1)
1.8 High-Power Ultrasonics
10(1)
1.9 Medical Ultrasonics
10(1)
1.10 Acousto-Optics
11(1)
1.11 Underwater Acoustics and Seismology
11(1)
References
11(2)
Chapter 2 Introduction to Vibrations and Waves 13(20)
2.1 Vibrations
13(11)
2.1.1 Vibrational Energy
15(1)
2.1.2 Exponential Solutions: Phasors
15(1)
2.1.3 Damped Oscillations
16(1)
2.1.4 Forced Oscillations
17(2)
2.1.5 Phasors and Linear Superposition of Simple Harmonic Motion
19(2)
2.1.6 Fourier Analysis
21(1)
2.1.7 Nonperiodic Waves: Fourier Integral
22(2)
2.2 Wave Motion
24(6)
2.2.1 Harmonic Waves
26(1)
2.2.2 Plane Waves in Three Dimensions
27(1)
2.2.3 Dispersion, Group Velocity, and Wave Packets
28(2)
Summary
30(1)
Questions
30(1)
Reference
31(2)
Chapter 3 Bulk Waves in Fluids 33(18)
3.1 One-Dimensional Theory of Fluids
33(7)
3.1.1 Sound Velocity
35(3)
3.1.1.1 Gases
36(1)
3.1.1.2 Liquids
37(1)
3.1.2 Acoustic Impedance
38(1)
3.1.3 Energy Density
39(1)
3.1.4 Acoustic Intensity
40(1)
3.2 Three-Dimensional Model
40(8)
3.2.1 Acoustic Poynting Vector
42(1)
3.2.2 Attenuation
43(31)
3.2.2.1 Decibel Scale of Attenuation
44(1)
3.2.2.2 Relaxation Time Formulation for Viscosity
44(1)
3.2.2.3 Attenuation Due to Viscosity
45(1)
3.2.2.4 Attenuation Due to Thermal Conduction
46(1)
3.2.2.5 Molecular Relaxation
47(1)
Summary
48(1)
Questions
48(1)
References
49(2)
Chapter 4 Introduction to the Theory of Elasticity 51(14)
4.1 A Short Introduction to Tensors
51(1)
4.2 Strain Tensor
52(3)
4.3 Stress Tensor
55(1)
4.4 Thermodynamics of Deformation
56(1)
4.5 Hooke's Law
57(4)
4.6 Other Elastic Constants
61(2)
Summary
63(1)
Questions
64(1)
References
64(1)
Chapter 5 Bulk Acoustic Waves in Solids 65(16)
5.1 1D Model of Solids
65(2)
5.2 Wave Equation in Three Dimensions
67(3)
5.3 Material Properties
70(4)
5.4 Viscoelastic Solids
74(4)
5.4.1 Viscoelastic Models
75(2)
5.4.2 Wave Propagation
77(1)
Summary
78(1)
Questions
78(1)
References
79(2)
Chapter 6 Finite Beams: Radiation, Diffraction, and Scattering 81(20)
6.1 Radiation
81(10)
6.1.1 Point Source
81(3)
6.1.2 Radiation from a Circular Piston
84(7)
6.1.2.1 Fraunhofer (Far-Field) Region
84(5)
6.1.2.2 Fresnel (Near-Field) Approximation
89(2)
6.2 Scattering
91(3)
6.2.1 The Cylinder
92(1)
6.2.2 The Sphere
93(1)
6.3 Focused Acoustic Waves
94(2)
6.4 Radiation Pressure
96(1)
6.5 Doppler Effect
97(2)
Summary
99(1)
Questions
99(1)
References
100(1)
Chapter 7 Reflection and Transmission of Ultrasonic Waves at Interfaces 101(24)
7.1 Introduction
101(2)
7.2 Reflection and Transmission at Normal Incidence
103(5)
7.2.1 Standing Waves
105(2)
7.2.2 Reflection from a Layer
107(1)
7.3 Oblique Incidence: Fluid-Fluid Interface
108(3)
7.3.1 Symmetry Considerations
111(1)
7.4 Fluid-Solid Interface
111(9)
7.5 Solid-Solid Interface
120(2)
7.5.1 Solid-Solid Interface: SH Modes
120(1)
7.5.2 Reflection at a Free Solid Boundary
121(1)
Summary
122(1)
Questions
122(1)
References
123(2)
Chapter 8 Rayleigh Waves 125(16)
8.1 Introduction
125(1)
8.2 Rayleigh Wave Propagation
125(5)
8.3 Fluid-Loaded Surface
130(8)
8.3.1 Beam Displacement
134(3)
8.3.2 Lateral Waves: Summary of Leaky Rayleigh Waves
137(1)
8.3.3 Stoneley Waves at a Liquid-Solid Interface
137(1)
Summary
138(1)
Questions
139(1)
References
139(2)
Chapter 9 Lamb Waves 141(10)
9.1 Potential Method for Lamb Waves
141(6)
9.2 Fluid-Loading Effects
147(3)
9.2.1 Fluid-Loaded Plate: One Side
147(1)
9.2.2 Fluid-Loaded Plate: Same Fluid Both Sides
148(1)
9.2.3 Fluid-Loaded Plate: Different Fluids
148(1)
9.2.4 Fluid-Loaded Solid Cylinder
149(1)
9.2.5 Fluid-Loaded Tubes
149(1)
Summary
150(1)
Questions
150(1)
References
150(1)
Chapter 10 Acoustic Waveguides 151(24)
10.1 Introduction: Partial Wave Analysis
151(1)
10.2 Waveguide Equation: SH Modes
151(4)
10.3 Lamb Waves
155(1)
10.4 Rayleigh Waves
156(1)
10.5 Layered Substrates
157(10)
10.5.1 Love Waves
158(3)
10.5.2 Generalized Lamb Waves
161(4)
10.5.3 Stoneley Waves
165(2)
10.6 Multilayer Structures
167(1)
10.7 Free Isotropic Cylinder
168(1)
10.8 Waveguide Configurations
169(2)
10.8.1 Overlay Waveguides
170(1)
10.8.1.1 Slot Waveguide
170(1)
10.8.1.2 Shorting Strip Waveguide
170(1)
10.8.2 Topographic Waveguides
171(1)
10.8.3 Circular Fiber Waveguides
171(1)
Summary
171(1)
Questions
172(1)
References
172(3)
Chapter 11 Crystal Acoustics 175(12)
11.1 Introduction
175(2)
11.1.1 Cubic System
176(1)
11.2 Group Velocity and Characteristic Surfaces
177(3)
11.3 Piezoelectricity
180(5)
11.3.1 Introduction
180(1)
11.3.2 Piezoelectric Constitutive Relations
181(3)
11.3.3 Piezoelectric Coupling Factor
184(1)
Summary
185(1)
Questions
186(1)
References
186(1)
Chapter 12 Cavitation and Sonoluminescence 187(26)
12.1 Bubble Dynamics
187(6)
12.1.1 Quasistatic Bubble Description
187(1)
12.1.2 Bubble Dynamics
188(3)
12.1.2.1 Bjerknes Forces
190(1)
12.1.2.2 Rectified Diffusion
190(1)
12.1.3 Acoustic Emission
191(1)
12.1.4 Acoustic Response of Bubbly Liquids
191(2)
12.2 Multibubble Sonoluminescence
193(3)
12.2.1 Summary of Experimental Results
194(2)
12.3 Single Bubble SL
196(14)
12.3.1 Introduction
196(1)
12.3.2 Experimental Setup
197(3)
12.3.3 Bubble Dynamics
200(2)
12.3.3.1 Bubble Stability
201(1)
12.3.4 Key Experimental Results in Water
202(4)
12.3.4.1 SBSL Spectrum
202(1)
12.3.4.2 Direct Test of the DH Hypothesis
203(1)
12.3.4.3 SBSL Pulse Width
204(1)
12.3.4.4 Shock Waves
204(1)
12.3.4.5 Ambient Pressure Variation
205(1)
12.3.5 Successful Models in Water
206(1)
12.3.6 SBSL in Other Liquids
206(3)
12.3.7 Similarities between MBSL and SBSL
209(1)
Summary
210(1)
Questions
210(1)
References
211(2)
Chapter 13 Bulk Acoustic Wave Transducers, Delay Lines, and Oscillators 213(20)
13.1 Bulk Acoustic Wave Transducers
213(6)
13.1.1 Unloaded Transducer
216(2)
13.1.2 Loaded Transducer
218(1)
13.2 Bulk Acoustic Wave Delay Lines
219(5)
13.2.1 Pulse Echo Mode
219(2)
13.2.2 Buffer Rod Materials
221(1)
13.2.3 Acoustic Losses in Buffer Rods
222(1)
13.2.3.1 Diffraction
222(1)
13.2.3.2 Parallelism
222(1)
13.2.4 BAW Buffer Rod Applications
223(1)
13.2.5 Clad Buffer Rods
223(1)
13.3 Quartz Crystal Resonators
224(4)
13.3.1 Introduction
224(2)
13.3.2 Cuts and Modes
226(1)
13.3.3 Resonator Structure and Packaging
226(1)
13.3.4 Recent Developments
227(1)
13.4 Silicon Oscillators
228(1)
Summary
229(1)
Questions
230(1)
References
230(3)
Chapter 14 Surface Acoustic Wave Transducers, Analog Signal Processing, and Mobile Applications 233(26)
14.1 Introduction
233(1)
14.2 Basic Components
234(6)
14.2.1 Interdigital Transducer
234(3)
14.2.1.1 Other Models
235(2)
14.2.2 Delay Line Configuration
237(1)
14.2.3 Reflective Arrays
238(1)
14.2.4 Multistrip Coupler
239(1)
14.3 Materials and Technology
240(1)
14.3.1 Substrates
240(1)
14.3.2 Temperature Coefficient of Delay
240(1)
14.3.3 Pseudo-Saw Modes
241(1)
14.3.4 Electrodes
241(1)
14.4 Signal Processing
241(9)
14.4.1 Delay Lines
241(1)
14.4.2 Bandpass Filter
242(3)
14.4.3 Resonators and Resonator Filters
245(2)
14.4.3.1 One Port Resonator
245(1)
14.4.3.2 Two Port Resonator
246(1)
14.4.4 Oscillators
247(1)
14.4.5 Time-Coded Dispersive Elements
248(2)
14.4.5.1 Chirp
249(1)
14.4.5.2 Reflective Array Compression
249(1)
14.4.5.3 Convolver
249(1)
14.5 Saw Applications
250(3)
14.5.1 Historical Development
250(1)
14.5.2 SAW Filters in Mobile Devices
251(8)
14.5.2.1 IF Filters
251(1)
14.5.2.2 RF Filters
252(1)
14.6 Saw Wireless Communication to Coded Devices
253(2)
Summary
255(1)
Questions
256(1)
References
256(3)
Chapter 15 Microacoustics: RF MEMS, FBAR, and CMUT 259(24)
15.1 Introduction
259(1)
15.2 Overview of MEMS Technology
259(6)
15.2.1 Microelectronic Materials
260(1)
15.2.2 Patterning and Etching Techniques
261(1)
15.2.3 Doping
262(1)
15.2.4 CMOS Circuitry
263(1)
15.2.5 Micromachining and MEMS
263(2)
15.3 RF MEMS
265(3)
15.3.1 RF MEMS Resonators
265(1)
15.3.2 MEMS as Circuit Elements
266(1)
15.3.3 Chip Scale Atomic Clocks
267(1)
15.3.4 Practical Issues and Perspectives
268(1)
15.4 FBAR
268(8)
15.4.1 Historical Background
269(2)
15.4.2 FBAR and SMR Technology
271(1)
15.4.3 FBAR and SMR Devices
272(2)
15.4.4 Comparison of FBAR and SAW for RF Applications
274(1)
15.4.5 Conclusions and Perspectives
275(1)
15.5 CMUT Capacitive Transducers
276(4)
15.5.1 CMUT Fabrication Technology
277(2)
15.5.2 Performance Enhancement of CMUTs
279(1)
Summary
280(1)
Questions
280(1)
References
281(2)
Chapter 16 Acoustic Sensors 283(46)
16.1 Thickness-Shear Mode Resonators
283(7)
16.1.1 TSM Resonator in Liquid
287(1)
16.1.2 TSM Resonator with a Viscoelastic Film
288(1)
16.1.3 Lateral Field Excited Sensors
289(1)
16.1.4 Electrodeless QCM Sensors
290(1)
16.2 Saw Sensors
290(6)
16.2.1 SAW Interactions
291(1)
16.2.2 Acoustoelectric Interaction
292(3)
16.2.3 Elastic and Viscoelastic Films on SAW Substrates
295(1)
16.2.4 Wireless SAW Sensors
295(1)
16.3 SH-Type Sensors
296(4)
16.3.1 Acoustic Plate Mode Sensors
296(2)
16.3.2 SH-SAW Sensor
298(1)
16.3.3 Love Mode Sensors
299(1)
16.3.4 Surface Transverse Wave Sensors
299(1)
16.4 Flexural Plate Wave Sensors
300(3)
16.5 CMUT Chem/Biosensor
303(1)
16.6 FBAR Liquid Sensors
303(1)
16.7 Thin-Rod Acoustic Sensors
304(3)
16.8 Gravimetric Sensitivity Analysis and Comparison
307(4)
16.9 Physical Sensing of Liquids
311(5)
16.9.1 Density Sensing
311(1)
16.9.2 Viscosity Sensing
312(1)
16.9.3 Temperature Sensing
313(1)
16.9.4 Flow Sensing
314(1)
16.9.5 Level Sensing
315(1)
16.10 Chemical Gas Sensors
316(4)
16.10.1 Introduction
316(1)
16.10.2 Chemical Interfaces for Sensing
316(1)
16.10.3 Sensor Arrays
317(1)
16.10.4 Gas Chromatography with Acoustic Sensor Detection
318(1)
16.10.5 Artificial Olfactory Mucosa
318(2)
16.11 Taste Sensing: Electronic Tongue
320(1)
16.12 Biosensing
321(2)
16.13 Perspectives in Acoustic Sensors
323(1)
Summary
323(1)
Questions
324(1)
References
324(5)
Chapter 17 Focused Beam Acoustic Microscopy 329(26)
17.1 Introduction
329(4)
17.2 Resolution
333(5)
17.3 Acoustic Lens Design
338(3)
17.4 Contrast Mechanisms and Quantitative Measurements
341(5)
17.4.1 V(z) Theory
341(2)
17.4.2 Reflectance Function from Fourier Inversion
343(1)
17.4.3 Line Focus Beam
343(2)
17.4.4 Subsurface (Interior) Imaging
345(1)
17.5 Applications of Acoustic Microscopy
346(5)
17.5.1 Biological Samples
346(2)
17.5.2 Films and Substrates
348(1)
17.5.3 NDE of Materials
349(1)
17.5.4 NDE of Devices
350(1)
Summary
351(1)
Questions
352(1)
References
352(3)
Chapter 18 Near-Field Acoustic Microscopy 355(32)
18.1 Introduction
355(1)
18.2 Scanning Tunneling Microscope
356(1)
18.3 Atomic Force Microscope
357(2)
18.4 Ultrasonic AFM
359(2)
18.4.1 Physical Model for Dynamic Contact Mechanics
359(2)
18.5 Contact Resonance Force Microscopy
361(10)
18.5.1 Atomic Force Acoustic Microscopy
362(8)
18.5.1.1 Flexural Vibrations of Cantilevers with the End Unconstrained
364(1)
18.5.1.2 Flexural Vibrations of Cantilevers with the Tip in Contact
365(2)
18.5.1.3 Physical Model for Tip-Surface Contact
367(1)
18.5.1.4 Imaging
368(1)
18.5.1.5 Applications
368(2)
18.5.2 Ultrasonic Atomic Force Microscopy
370(1)
18.5.3 Lateral and TR Mode Microscopy
370(1)
18.5.3.1 Ultrasonic Friction Force Microscopy
370(1)
18.5.3.2 TR Mode or TR-AFM
371(1)
18.6 Mechanical Diode Effect Microscopy
371(5)
18.6.1 Ultrasonic Force Microscopy
371(3)
18.6.2 Mechanical Diode Ultrasonic Friction Force Microscopy
374(1)
18.6.3 Heterodyne Force Microscopy
374(1)
18.6.4 Scanning Near-Field Ultrasound Holography
374(2)
18.7 Acoustic Wave Probe Microscopy
376(4)
18.8 Other Probe Microscopies
380(2)
18.8.1 Piezoresponse Force Microscopy
380(1)
18.8.2 Optical Heterodyne Force Microscopy
381(1)
18.9 Perspectives
382(1)
Summary
382(1)
Questions
383(1)
References
384(3)
Chapter 19 Nondestructive Evaluation of Materials 387(28)
19.1 Introduction
387(3)
19.2 Surfaces
390(4)
19.2.1 Principles of Rayleigh Wave NDE
391(1)
19.2.2 Generation of Rayleigh Waves for NDE
392(1)
19.2.3 Critical Angle Reflectivity
392(2)
19.3 Plates
394(2)
19.3.1 Leaky Lamb Waves: Dispersion Curves
394(1)
19.3.2 NDE Using Leaky Lamb Waves
395(1)
19.4 Layered Structures
396(4)
19.4.1 Inversion Procedures
396(2)
19.4.2 Modal Frequency Spacing Method
398(2)
19.5 Adhesion
400(2)
19.6 Thickness Gauging
402(5)
19.6.1 Mode-Cutoff-Based Approaches
404(3)
19.7 Process Control
407(1)
19.8 Structural Health Monitoring
408(1)
19.9 Time Reversal Mirrors
409(2)
Summary
411(1)
Questions
412(1)
References
412(3)
Chapter 20 Non/Loosely Contacting NDE Techniques 415(30)
20.1 Laser Ultrasonics
415(12)
20.1.1 Laser Generation of Ultrasound
416(1)
20.1.2 Laser Detection of Ultrasound
417(2)
20.1.2.1 Homodyne Reference Beam Interferometry
417(1)
20.1.2.2 Heterodyne Reference Beam Interferometry
418(1)
20.1.2.3 Self-Referential Interferometry
418(1)
20.1.2.4 Fiber Optic Ultrasound Sensors
419(1)
20.1.2.5 Sensitivity Considerations
419(1)
20.1.3 NDE Applications
419(5)
20.1.3.1 Microelectronic Device Characterization
420(4)
20.1.4 Picosecond Laser Ultrasonics
424(3)
20.1.4.1 Dispersion or Long-Wavelength Phonons
425(1)
20.1.4.2 Experimental Setup and Data Analysis
426(1)
20.1.4.3 FBAR Characterization
426(1)
20.2 Electromagnetic Acoustic Transducers
427(5)
20.2.1 Generation
428(2)
20.2.2 Detection
430(1)
20.2.3 Configurations and Operation
430(1)
20.2.4 Applications
431(1)
20.3 Air-Coupled Transducers
432(4)
20.3.1 Piezoelectric Transducers
433(1)
20.3.2 Capacitive and Micromachined Transducers
434(1)
20.3.3 Comparison of Transducer Sensitivities
435(1)
20.4 Resonant Ultrasound Spectroscopy
436(5)
20.4.1 Theoretical Background and Data Analysis
437(1)
20.4.2 Experimental Methods
438(1)
20.4.3 Special Techniques
438(1)
20.4.4 Resonant Ultrasound Microscopy
439(2)
Summary
441(1)
Questions
441(1)
References
442(3)
Appendix A: Bessel Functions 445(2)
Appendix B: Acoustic Properties of Materials 447(22)
Appendix C: Complementary Laboratory Experiments 469(6)
Index 475
J. David N. Cheeke received his bachelors and masters degrees in engineering physics from the University of British Columbia, Vancouver, Canada, in 1959 and 1961, respectively, and his Ph.D in low temperature physics from Nottingham University, United Kingdom, in 1965. He then joined the Low Temperature Laboratory, CNRS, Grenoble, France, and also served as professor of physics at the Université de Grenoble. In 1975, Dr. Cheeke moved to the Université de Sherbrooke, Canada, where he set up an ultrasonics laboratory, specializing in physical acoustics, acoustic microscopy, and acoustic sensors. In 1991, he joined the physics department at Concordia University, Montreal, where he was head of an ultrasonics laboratory. He was chair of the department from 1992 to 2000. In 2003 he retired from Concordia University and became Vice President, Operations, of Microbridge Technologies, Inc., Montreal, a spinoff from Concordia University. He retired from Microbridge in 2006 and has lived in Victoria, BC, since that time. He has published more than 150 papers on various aspects of ultrasonics and acoustics. He is a senior member of the IEEE.