Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development of a complete electronic system. The book then addresses the various analysis methods and techniques that can be used during the electronics design process. Emphasis is placed on those engineering tasks and issues essential to the system design for reliability. The book concludes with a chapter on design for reliability and on electronic material properties. Annotation copyright Book News, Inc. Portland, Or.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Recenzijas
"Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. " ---IEEE Book Review
"Introduction, Michael D. Osterman and Michael Pecht Electronic
Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed
Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall
Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors,
Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht
Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III
Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock
Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and
Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht
Electronic Materials and Properties, Jillian Y. Evans and John W. Evans
Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid
Microcircuits Packaging Terms Appendix C: Standards and Specifications for
Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs
Appendix E: Unit Conversion Tables "
Michael Pecht
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