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Intelligent Computing and Internet of Things: First International Conference on Intelligent Manufacturing and Internet of Things and 5th International Conference on Computing for Sustainable Energy and Environment, IMIOT and ICSEE 2018, Chongqing, China, September 21-23, 2018, Proceedings, Part II 2018 ed. [Mīkstie vāki]

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  • Formāts: Paperback / softback, 569 pages, height x width: 235x155 mm, weight: 896 g, 297 Illustrations, black and white; XXI, 569 p. 297 illus., 1 Paperback / softback
  • Sērija : Communications in Computer and Information Science 924
  • Izdošanas datums: 04-Sep-2018
  • Izdevniecība: Springer Verlag, Singapore
  • ISBN-10: 9811323836
  • ISBN-13: 9789811323836
  • Mīkstie vāki
  • Cena: 46,91 €*
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  • Formāts: Paperback / softback, 569 pages, height x width: 235x155 mm, weight: 896 g, 297 Illustrations, black and white; XXI, 569 p. 297 illus., 1 Paperback / softback
  • Sērija : Communications in Computer and Information Science 924
  • Izdošanas datums: 04-Sep-2018
  • Izdevniecība: Springer Verlag, Singapore
  • ISBN-10: 9811323836
  • ISBN-13: 9789811323836
The three-volume set CCIS 923, CCIS 924, and CCIS 925 constitutes the thoroughly refereed proceedings of the First International Conference on Intelligent Manufacturing and Internet of Things, and of the 5th International Conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2018, held in Chongqing, China, in September 2018.





The 135 revised full papers presented were carefully reviewed and selected from over 385 submissions.The papers of this volume are organized in topical sections on: digital manufacturing; industrial product design; logistics, production and operation management; manufacturing material; manufacturing optimization; manufacturing process; mechanical transmission system; robotics.

Advanced evolutionary computing theory and algorithms.- Big data analytics.- Fault diagnosis and maintenance.- Intelligent computing in robotics.- Intelligent control and automation.- IoT systems.- Neural networks and deep learning.- Precision measurement and instrumentation.- Image processing.