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Low-Power CMOS Digital Pixel Imagers for High-Speed Uncooled PbSe IR Applications 1st ed. 2017 [Hardback]

  • Formāts: Hardback, 173 pages, height x width: 235x155 mm, weight: 4203 g, 4 Illustrations, color; 101 Illustrations, black and white; XXI, 173 p. 105 illus., 4 illus. in color., 1 Hardback
  • Sērija : Springer Theses
  • Izdošanas datums: 09-Jan-2017
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3319499610
  • ISBN-13: 9783319499611
  • Hardback
  • Cena: 91,53 €*
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  • Formāts: Hardback, 173 pages, height x width: 235x155 mm, weight: 4203 g, 4 Illustrations, color; 101 Illustrations, black and white; XXI, 173 p. 105 illus., 4 illus. in color., 1 Hardback
  • Sērija : Springer Theses
  • Izdošanas datums: 09-Jan-2017
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3319499610
  • ISBN-13: 9783319499611
This book describes the development of a new low-cost medium wavelength IR (MWIR) monolithic imager technology for high-speed uncooled industrial applications. It takes the baton on the latest technological advances in the field of vapor phase deposition (VPD) PbSe-based MWIR detection accomplished by the industrial partner NIT S.L., adding fundamental knowledge on the investigation of novel VLSI analog and mixed-signal design techniques at circuit and system levels for the development of the readout integrated device attached to the detector. In order to fulfill the operational requirements of VPD PbSe, this work proposes null inter-pixel crosstalk vision sensor architectures based on a digital-only focal plane array (FPA) of configurable pixel sensors. Each digital pixel sensor (DPS) cell is equipped with fast communication modules, self-biasing, offset cancellation, analog-to-digital converter (ADC) and fixed pattern noise (FPN) correction. In-pixel power consumption is minimiz

ed by the use of comprehensive MOSFET subthreshold operation.

Introduction.- Frame-Based Smart IR Imagers.- Frame-Free Compact-Pitch IR Imagers.- Pixel Test Chips in 0.35mm and 0.15mm CMOS Technologies.- Imager Test Chips in 2.5mm, 0.35mm and 0.15mm CMOS Technologies.- Conclusions.
Introduction.- Frame-Based Smart IR Imagers.- Frame-Free Compact-Pitch
IR Imagers.- Pixel Test Chips in 0.35mm and 0.15mm CMOS Technologies.- Imager
Test Chips in 2.5mm, 0.35mm and 0.15mm CMOS Technologies.- Conclusions.