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Manufacturing Sciences and Technologies X [Mīkstie vāki]

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  • Formāts: Paperback / softback, 222 pages, height x width x depth: 240x170x11 mm, weight: 520 g, Illustrations, unspecified
  • Sērija : Solid State Phenomena
  • Izdošanas datums: 09-Jul-2020
  • Izdevniecība: Trans Tech Publications Ltd
  • ISBN-10: 3035716579
  • ISBN-13: 9783035716573
Citas grāmatas par šo tēmu:
  • Mīkstie vāki
  • Cena: 262,79 €
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  • Formāts: Paperback / softback, 222 pages, height x width x depth: 240x170x11 mm, weight: 520 g, Illustrations, unspecified
  • Sērija : Solid State Phenomena
  • Izdošanas datums: 09-Jul-2020
  • Izdevniecība: Trans Tech Publications Ltd
  • ISBN-10: 3035716579
  • ISBN-13: 9783035716573
Citas grāmatas par šo tēmu:
This volume contains papers that were presented at the the 10th "International Conference on Manufacturing Science and Technology" (ICMST 2019), 3rd "International Conference on Sensors, Materials and Manufacturing" (ICSMM 2019) and 2019 "International Conference on Functional Materials and Applied Technologies" (FMAT 2019). Collected papers reflect the last research results in the field of materials science, modern processing technologies and methods of choosing and optimization of technological parameters.
Preface
Chapter 1: Composite Materials
The Effects of Alkalization on Mechanical and Physical Properties of
Bamboo-Polypropylene Composite
Enhancing Mechanical Performance of Bagasse Fiber-Epoxy Composite by Surface
Treatment
The Effect of Aging on the Decrease in Tensile Strength of Composites with
Palm Oil Kernel Shell Powder
Improvement of Binderless Banana Pseudo-Stem Particleboard Properties via
Natural Laminating Materials
Degradation Behaviour of Nanosilica Enhanced Oil Palm Empty Fruit Bunch Fiber
Epoxy Composites
Ceramic Membrane Production from the Mixture Composition of Clay, Zeolite,
Activated Carbon with Micro Particle Size
The Process Development for Sound Absorption Design of Non-Woven Car Mat
An Experimentally and Numerically Comparison between E-Glass/Epoxy and
Basalt/Epoxy Pipes Pressurized Internally
Chapter 2: Materials and Technologies for Microelectronics
Contactless Chip Module Defect Reduction
Preparation of Rutile TiO2 Film by Low Temperature Hydrothermal
Corrosion of the Materials in the Electrical Connectors
Double Perovskite Bi2FeCrO6 Thin Films for Photovoltaics
Chapter 3: Building Materials and Structures
A Comparison on Column Reinforcement with Conventional Concrete and Carbon
Fiber / Epoxy Exposed to Compression Loading
Characterization of Geopolymer Binder Using Sidoarjo Mud
Eco-Friendly Thermal Insulation Structures Based on Natural and Biodegradable
Materials for Environmentally Durable Development
Comparison and Transmission Studies of Commercial Glass and Laminated Glass
with PDLC Film for Heat Resistant and Other Building Structure Applications
Chapter 4: Materials Processing Technologies
Effect of Ultrasonic Surface Rolling Process Parameters on Surface Properties
of S30408 Austenitic Stainless Steel
Effect of Coolant Type on Surface Roughness and RSM Modelling in Single-Point
Diamond Turning of RSA443 Optical Aluminum
Machinability and Delamination Studies on Glass Fiber Reinforced Polymer
Matrix Composite Cut by Abrasive Water Jet Machine
Effects of Helium Addition to Ar-Based Shielding Gas on the Lap-Joint
Performance of 5052 Aluminum Alloy to Galvanized Steel Sheet during the MIG
Weld-Brazing Process
Chapter 5: Choosing and Optimization of Technological Process Parameters in
Materials Processing
Implementation of Neural Network in Classifying the Product Quality for the
ABS Metallization
Defect Reduction in Forming Process of Fired Clay Floor Tiles by Six Sigma
Approach
Chipping Size Reduction on Ultra-Thin Wafers and Narrow Saw-Streets for Wafer
Sawing Process
Energy Consumption Prediction Model of SiCp/Al Composite in Grinding Based on
PSO-BP Neural Network
Application of Neural Network in Predicting Forging Hardness
Simulation Based Mold Design Optimization of a Spring Flap Casting
Comparative Study of Optical Silicon Nanomachining Experimental Results and
MD Simulation Outputs
Effect of Process Parameters on Surface Roughness in Surface Grinding of
90CrSi Tool Steel
Finite Element Stress Characterization of Stacked Die Package for Reliability
Improvement and Architecture Optimization