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xxvii | |
Preface |
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xxxi | |
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Polymer Materials Characterization, Modeling and Application |
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3 | (62) |
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3 | (1) |
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Polymers in Microelectronics |
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4 | (2) |
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Basics of Visco-Elastic Modeling |
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6 | (12) |
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Preliminary: State Dependent Viscoelasticity |
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6 | (4) |
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10 | (3) |
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Linear State Dependent Viscoelasticity |
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13 | (1) |
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Isotropic Material Behavior |
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14 | (1) |
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Interrelations between Property Functions |
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15 | (2) |
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17 | (1) |
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Linear Visco-Elastic Modeling (Fully Cured Polymers) |
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18 | (16) |
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18 | (1) |
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Static Testing of Relaxation Moduli |
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18 | (5) |
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Time-Temperature Superposition Principle |
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23 | (1) |
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Static Testing of Creep Compliances |
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24 | (3) |
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27 | (7) |
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Modeling of Curing Polymers |
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34 | (19) |
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``Partly State Dependent'' Modeling (Curing Polymers) |
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35 | (14) |
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``Fully State Dependent'' Modeling (Curing Polymers) |
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49 | (4) |
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Parameterized Polymer Modeling (PPM) |
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53 | (12) |
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54 | (1) |
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Experimental Characterizations |
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55 | (7) |
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PPM Modeling in Virtual Prototyping |
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62 | (1) |
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62 | (1) |
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62 | (3) |
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Thermo-Optic Effects in Polymer Bragg Gratings |
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65 | (46) |
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65 | (2) |
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Fundamentals of Bragg Gratings |
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67 | (3) |
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67 | (1) |
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68 | (2) |
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Thermo-Optical Modeling of Polymer Fiber Bragg Grating |
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70 | (14) |
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Heat Generation by Intrinsic Absorption |
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70 | (8) |
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Analytical Thermal Model of PFBG |
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78 | (2) |
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FEA Thermal Model of PFBG |
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80 | (1) |
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Thermo-Optical Model of PFBG |
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80 | (4) |
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Thermo-Optical Behavior of PMMA-Based PFBG |
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84 | (18) |
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Description of a PMMA-Based PFBG and Light Sources |
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85 | (1) |
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Power Variation Along the PFBG |
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86 | (1) |
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Thermo-Optical Behavior of the PFBG-LED Illumination |
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87 | (5) |
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Thermo-Optical Behavior of the PFBG-SM LD Illumination |
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92 | (9) |
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Thermo-Optical Behavior of the PFBG Associated with Other Light Sources |
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101 | (1) |
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102 | (9) |
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102 | (2) |
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Appendix 2.A: Solution Procedure to Obtain the Optical Power Along the PFBG |
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104 | (2) |
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Appendix 2.B: Solution Procedure to Determine the Temperature Profile Along the PFBG |
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106 | (1) |
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Solution Procedure of the Temperature Profile Along the PFBG with the LED |
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106 | (1) |
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Solution Procedure of the Temperature Profile Along the PFBG with the SM LD |
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106 | (5) |
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Photorefractive Materials and Devices for Passive Components in WDM Systems |
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111 | (24) |
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111 | (3) |
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Tunable Flat-Topped Filter |
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114 | (3) |
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114 | (2) |
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116 | (1) |
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Design for Implementation |
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117 | (1) |
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Wavelength Selective 2x2 Switch |
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117 | (9) |
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118 | (1) |
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Experimental Demonstration |
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119 | (2) |
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121 | (2) |
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123 | (2) |
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125 | (1) |
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High Performance Dispersion Compensators |
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126 | (7) |
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Multi-Channel Dispersion-Slope Compensator |
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126 | (3) |
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High Precision FBG Fabrication Method and Dispersion Management Filters |
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129 | (4) |
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133 | (2) |
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133 | (2) |
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Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability |
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135 | (46) |
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135 | (2) |
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135 | (1) |
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136 | (1) |
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136 | (1) |
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Thin Film Structures and Materials |
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137 | (6) |
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137 | (1) |
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137 | (3) |
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140 | (1) |
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141 | (1) |
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Organic and Polymer Films |
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142 | (1) |
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142 | (1) |
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Intermediate Layers: Adhesion, Barrier, Buffer, and Seed Layers |
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142 | (1) |
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Manufacturability/Reliability Challenges |
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143 | (14) |
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Film Deposition and Stress |
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144 | (3) |
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Grain Structure and Texture |
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147 | (4) |
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151 | (1) |
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152 | (1) |
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Electromigration and Voiding |
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153 | (2) |
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Structural Considerations |
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155 | (1) |
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Need for Mechanical Characterization |
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155 | (1) |
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156 | (1) |
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Methods for mechanical characterization of thin films |
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157 | (15) |
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157 | (2) |
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159 | (5) |
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164 | (1) |
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165 | (7) |
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172 | (1) |
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Grain Size and Structure Size Effects |
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172 | (1) |
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Properties of Specific Materials |
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173 | (2) |
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175 | (6) |
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175 | (1) |
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175 | (1) |
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175 | (1) |
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176 | (5) |
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Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges |
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181 | (24) |
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Introduction: Physical Characteristics of Carbon Nanotubes |
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181 | (5) |
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181 | (1) |
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182 | (3) |
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185 | (1) |
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186 | (1) |
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CNT Fabrication Technologies |
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186 | (5) |
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Chemical Vapor Deposition of Carbon Nanotubes |
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187 | (2) |
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Process Integration and Development |
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189 | (2) |
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Carbon Nanotubes as Interconnects |
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191 | (3) |
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Limitations of the Current Technology |
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191 | (1) |
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Architecture, Geometry and Performance Potential Using Carbon Nanotubes |
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191 | (3) |
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Design, Manufacture and Reliability |
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194 | (6) |
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Microstructural Attributes and Effects on Electrical Characteristics |
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194 | (2) |
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Interfacial Contact Materials |
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196 | (2) |
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End-contacted Metal-CNT Junction |
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198 | (1) |
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Thermal Stress Characteristics |
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198 | (1) |
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199 | (1) |
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200 | (5) |
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200 | (5) |
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Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems |
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205 | (64) |
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205 | (1) |
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Physical Aspects for Numerical Simulations |
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206 | (19) |
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208 | (3) |
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Material Properties and Models |
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211 | (4) |
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Thermo-Mechanical Related Failures |
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215 | (4) |
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Designing for Reliability |
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219 | (6) |
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Mathematical Aspects of Optimization |
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225 | (27) |
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226 | (10) |
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Response Surface Modeling |
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236 | (6) |
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Advanced Approach to Virtual Prototyping |
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242 | (7) |
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249 | (3) |
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252 | (7) |
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252 | (1) |
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Numerical Approach to QFN Package Design |
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253 | (6) |
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Conclusion and Challenges |
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259 | (5) |
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264 | (5) |
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264 | (1) |
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264 | (5) |
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Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension |
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269 | (14) |
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269 | (1) |
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Fiber Optics Structural Mechanics |
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270 | (3) |
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270 | (3) |
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New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Applications |
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273 | (4) |
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New Nano-Particle Material (NPM) |
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273 | (1) |
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NPM-Based Optical Silica Fibers |
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274 | (3) |
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277 | (6) |
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277 | (1) |
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277 | (6) |
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Area Array Technology for High Reliability Applications |
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283 | (30) |
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283 | (1) |
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Area Array Packages (AAPs) |
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284 | (2) |
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Advantages of Area Array Packages |
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285 | (1) |
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Disadvantages of Area Arrays |
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285 | (1) |
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286 | (1) |
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Chip Scale Packages (CSPs) |
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286 | (2) |
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288 | (5) |
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288 | (1) |
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Plastic Area Array Packages |
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288 | (1) |
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Plastic Package Assembly Reliability |
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289 | (2) |
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Reliability Data for BGA, Flip Chip BGA, and CSP |
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291 | (2) |
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293 | (16) |
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293 | (1) |
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Ceramic Package Assembly Reliability |
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294 | (1) |
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Literature Survey on CBGA/CCGA Assembly Reliability |
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295 | (2) |
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297 | (5) |
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Comparison of 560 I/O PBGA and CCGA assembly reliability |
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302 | (3) |
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Designed Experiment for Assembly |
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305 | (4) |
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309 | (1) |
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List of Acronyms and Symbols |
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310 | (3) |
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311 | (1) |
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311 | (2) |
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Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections |
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313 | (38) |
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313 | (2) |
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315 | (9) |
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The Four Steps of The Iterative Approach |
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315 | (6) |
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The Role of Different Simulation Tools in Reliability Engineering |
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321 | (3) |
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Interconnection Microstructures and Their Evolution |
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324 | (11) |
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324 | (1) |
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Solidification Structure and the Effect of Contact Metalization Dissolution |
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325 | (5) |
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Interfacial Reactions Products |
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330 | (3) |
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Deformation Structures (Due to Slip and Twinning) |
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333 | (2) |
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Recovery, Recrystallization and Grain Growth |
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335 | (1) |
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Two Case Studies on Reliability Testing |
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335 | (12) |
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Case 1: Reliability of Lead-Free CSPs in Thermal cycling |
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337 | (4) |
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Case 2: Reliability of Lead-Free CSPs in Drop Testing |
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341 | (6) |
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347 | (4) |
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348 | (1) |
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348 | (3) |
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Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections |
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351 | (60) |
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351 | (1) |
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Physical Metallurgy of Lead-Free Solder Alloys |
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352 | (25) |
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352 | (1) |
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353 | (4) |
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Interfacial Reaction: Wetting and Spreading |
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357 | (6) |
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Interfacial Intermetallic Formation and Growth at Liquid-Solid Interfaces |
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363 | (14) |
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Lead-Free Soldering Processes and Compatibility |
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377 | (11) |
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Lead-Free Soldering Materials |
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378 | (2) |
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PCB Substrates and Metalization Finishes |
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380 | (1) |
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Lead-Free Soldering Processes |
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381 | (3) |
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Components for Lead-Free Soldering |
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384 | (3) |
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Design, Equipment and Cost Considerations |
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387 | (1) |
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Reliability of Pb-Free Solder Interconnects |
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388 | (18) |
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Reliability and Failure Distribution of Pb-Free Solder Joints |
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388 | (1) |
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Effects of Loading and Thermal Conditions on Reliability of Solder Interconnection |
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389 | (6) |
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Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints |
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395 | (11) |
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Guidelines for Pb-free Soldering and Improvement in Reliability |
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406 | (5) |
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406 | (5) |
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Fatigue Life Assessment for Lead-Free Solder Joints |
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411 | (18) |
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411 | (1) |
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The Intermetallic Compound Formed at the Interface of the Solder Joints and the Cu-pad |
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412 | (1) |
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Mechanical Fatigue Testing Equipment and Load Condition in the Lead Free Solder |
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413 | (1) |
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Results of Mechanical Fatigue Test |
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414 | (3) |
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Critical Fatigue Stress Limit for the Intermetallic Compound Layer |
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417 | (7) |
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Influence of the Plating Material on the Fatigue Life of Sn-Zn (Sn-9Zn and Sn-8Zn-3Bi) Solder Joints |
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424 | (2) |
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426 | (3) |
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426 | (3) |
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Lead-Free Solder Materials: Design For Reliability |
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429 | (30) |
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429 | (1) |
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Mechanics of Solder Materials |
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430 | (3) |
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Fatigue Behavior of Solder Materials |
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431 | (2) |
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Design For Reliability (DFR) |
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433 | (2) |
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Constitutive Models For Lead Free Solders |
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435 | (8) |
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435 | (5) |
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440 | (3) |
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443 | (5) |
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FEA Modeling and Simulation |
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448 | (6) |
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Reliability Test and Analysis |
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454 | (2) |
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456 | (3) |
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456 | (1) |
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456 | (3) |
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Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures |
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459 | (16) |
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459 | (1) |
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Optical Method and Recording of Fringe Patterns |
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460 | (3) |
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Fractional Fringe Approach |
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461 | (1) |
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Grating Frequency Increase |
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461 | (1) |
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Creation of a High-Frequency Master Grating |
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462 | (1) |
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Combination of the High Grating Frequency and Fractional Fringe Approach |
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463 | (1) |
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463 | (1) |
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Test Boards and Specimen Grating |
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463 | (2) |
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Elevated Temperature Test |
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465 | (3) |
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468 | (2) |
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470 | (5) |
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472 | (1) |
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473 | (2) |
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Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods |
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475 | (48) |
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475 | (1) |
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476 | (29) |
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476 | (1) |
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Extension: Microscopic Moire Interferometry |
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477 | (2) |
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479 | (1) |
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480 | (1) |
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Thermal Deformation Measured at Room Temperature |
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481 | (4) |
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Deformation as a Function of Temperature |
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485 | (9) |
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494 | (7) |
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501 | (4) |
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505 | (18) |
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Twyman/Green Interferometry |
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505 | (4) |
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509 | (5) |
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Far Infrared Fizeau Interferometry |
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514 | (6) |
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520 | (1) |
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520 | (3) |
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Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach |
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523 | (32) |
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523 | (2) |
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Heat Transfer and Moisture Diffusion in IC Packages |
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525 | (2) |
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Fundamentals of Interfacial Fracture Mechanics |
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527 | (2) |
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Criterion for Crack Propagation |
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529 | (1) |
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Interface Fracture Toughness |
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529 | (1) |
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Total Stress Intensity Factor |
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530 | (1) |
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Calculation of SERR and Mode Mixity |
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531 | (7) |
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Crack Surface Displacement Extrapolation Method |
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531 | (1) |
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Modified J-integral Method |
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532 | (1) |
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Modified Virtual Crack Closure Method |
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533 | (3) |
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Variable Order Boundary Element Method |
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536 | (1) |
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Interaction Integral Method |
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536 | (2) |
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Experimental Verification |
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538 | (4) |
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542 | (7) |
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Delamination Along Pad-Encapsulant Interface |
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542 | (2) |
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Delamination Along Die-Attach/Pad Interface |
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544 | (2) |
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Analysis Using Variable Order Boundary Element Method |
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546 | (3) |
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Discussion of the Various Numerical Methods for Calculating G and ψ |
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549 | (2) |
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551 | (4) |
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551 | (4) |
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Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension |
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555 | (16) |
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555 | (1) |
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556 | (1) |
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Extension: Quality of Shock Protection with a Flexible Wire Elements |
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557 | (1) |
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558 | (9) |
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Pre-Buckling Mode: Small Displacements |
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558 | (6) |
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Post-Buckling Mode: Large Displacements |
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564 | (3) |
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567 | (4) |
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568 | (3) |
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Dynamic Physical Reliability in Application to Photonic Materials |
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571 | (56) |
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Introduction: Dynamic Reliability Approach to the Evolution of Silica Fiber Performance |
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571 | (14) |
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Dynamic Physical Model of Damage Accumulation |
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572 | (3) |
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Impact of the Three-Dimensional Mechanical-Temperature-Humidity Load on the Optical Fiber Reliability |
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575 | (1) |
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Effect of Bimodality and Its Explanation Based on the Suggested Model |
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576 | (9) |
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Reliability Improvement through NPM-Based Fiber Structures |
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585 | (8) |
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Environmental Protection by NPM-Based Coating and Overall Self-Curing Effect of NPM Layers |
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585 | (2) |
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Improvement in the Reliability Characteristics by Employing NPM Structures in Optical Fibers |
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587 | (6) |
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593 | (2) |
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593 | (2) |
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High-Speed Tensile Testing of Optical Fibers---New Understanding for Reliability Prediction |
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595 | |
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595 | (1) |
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596 | (6) |
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Single-Region Power-Law Model |
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596 | (2) |
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Two-Region Power-Law Model |
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598 | (1) |
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Universal Static and Dynamic Fatigue Curves |
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599 | (3) |
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602 | (4) |
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602 | (2) |
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604 | (1) |
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605 | (1) |
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606 | (7) |
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606 | (4) |
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610 | (3) |
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Influence of Multiregion Model on Lifetime Prediction |
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613 | (1) |
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613 | (14) |
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614 | (2) |
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Appendix 18.A: High Speed Axial Strength Testing: Measurement Limits |
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616 | (4) |
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Appendix 18.B: Incorporating Static Fatigue Results into Dynamic Fatigue Curves |
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620 | (1) |
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620 | (1) |
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621 | (1) |
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622 | (5) |
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The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior |
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627 | (40) |
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627 | (3) |
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630 | (3) |
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Background on Nonlinear Dynamics and Nonlinear Thermo-Elasticity Theories |
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630 | (1) |
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Nonlinear Thermo-Elasticity Development for an Isotropic Laminate Subject to Thermal and Mechanical and Load |
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631 | (2) |
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Thin Laminate Deflection Response Subject to Thermal Effect and Mechanical Load |
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633 | (20) |
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Steady State Temperature Effect |
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633 | (5) |
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Transient Thermal Field Effect |
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638 | (15) |
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Stress Field in Nonlinear Dynamics Response |
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653 | (7) |
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653 | (1) |
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654 | (1) |
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654 | (6) |
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660 | (1) |
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661 | (6) |
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662 | (1) |
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663 | (1) |
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663 | (4) |
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Effect of Material's Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems |
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667 | (34) |
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667 | (1) |
|
Effect of Physical Nonlinearity on Vibrations of Piezoelectric Rods Driven by Alternating Electric Field |
|
|
668 | (15) |
|
Physically Nonlinear Constitutive Relationships for an Orthotropic Cylindrical Piezoelectric Rod Subject to an Electric Field in the Axial Direction |
|
|
670 | (3) |
|
Analysis of Uncoupled Axial Vibrations |
|
|
673 | (4) |
|
Solution for Coupled Axial-Radial Axisymmetric Vibrations by the Generalized Galerkin Procedure |
|
|
677 | (1) |
|
Numerical Results and Discussion |
|
|
678 | (5) |
|
The Effect of the Nonlinear Stress--Strain Relationship on the Response of Optical Fibers |
|
|
683 | (12) |
|
Stability of Optical Fibers |
|
|
684 | (2) |
|
Stresses and Strains in a Lightwave Coupler Subjected to Tension |
|
|
686 | (4) |
|
|
690 | (2) |
|
Bending of an Optical Fiber |
|
|
692 | (3) |
|
|
695 | (6) |
|
|
696 | (1) |
|
|
697 | (4) |
Index |
|
701 | (10) |
|
|
xxvii | |
Preface |
|
xxxi | |
|
|
|
Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results |
|
|
3 | (20) |
|
|
Thermal Loading and Thermal Stress Failures |
|
|
3 | (1) |
|
|
4 | (1) |
|
Bi-Metal Thermostats and other Bi-Material Assemblies |
|
|
5 | (1) |
|
|
5 | (1) |
|
Die-Substrate and other Bi-Material Assemblies |
|
|
6 | (2) |
|
|
8 | (1) |
|
|
9 | (1) |
|
``Global'' and ``Local'' Mismatch and Assemblies Bonded at the Ends |
|
|
10 | (1) |
|
Assemblies with Low Modulus Adhesive Layer at the Ends |
|
|
11 | (1) |
|
thermally Matched Assemblies |
|
|
11 | (1) |
|
|
12 | (1) |
|
Polymeric Materials And Plastic Packages |
|
|
13 | (1) |
|
Thermal Stress Induced Bowing and Bow-Free Assemblies |
|
|
14 | (1) |
|
|
15 | (1) |
|
Optical Fibers and other Photonic Structures |
|
|
15 | (1) |
|
|
16 | (7) |
|
|
17 | (6) |
|
Probabilistic Physical Design of Fiber-Optic Structures |
|
|
23 | (48) |
|
|
|
|
|
23 | (2) |
|
|
24 | (1) |
|
|
25 | (5) |
|
|
26 | (1) |
|
Refraction and Reflection Losses |
|
|
27 | (1) |
|
Calculations for Coupling Losses |
|
|
27 | (1) |
|
|
28 | (2) |
|
Interactions in System and Identification of Critical Variables |
|
|
30 | (7) |
|
Function Variable Incidence Matrix |
|
|
30 | (1) |
|
Function Variable Incidence Matrix to Graph Conversion |
|
|
31 | (3) |
|
Graph Partitioning Techniques |
|
|
34 | (1) |
|
System Decomposition using Simulated Annealing |
|
|
34 | (3) |
|
Deterministic Design Procedures |
|
|
37 | (7) |
|
Optimal and Robust Design |
|
|
40 | (2) |
|
A Brief Review of Multi-Objective Optimization |
|
|
42 | (1) |
|
|
43 | (1) |
|
|
43 | (1) |
|
|
44 | (2) |
|
The First and Second Order Second Moment Methods |
|
|
44 | (2) |
|
Probabilistic Design for Maximum Reliability |
|
|
46 | (5) |
|
|
49 | (2) |
|
Stochastic Characterization of Epoxy Behavior |
|
|
51 | (6) |
|
|
52 | (1) |
|
|
53 | (1) |
|
Dynamic Mechanical Analysis |
|
|
54 | (1) |
|
|
55 | (2) |
|
Analytical Model to Determine VCSEL Displacement |
|
|
57 | (10) |
|
|
63 | (4) |
|
|
67 | (4) |
|
|
67 | (4) |
|
The Wirebonded Interconnect: A Mainstay for Electronics |
|
|
71 | (50) |
|
|
|
71 | (10) |
|
Integrated Circuit Revolution |
|
|
71 | (1) |
|
|
72 | (8) |
|
|
80 | (1) |
|
|
81 | (14) |
|
Thermocompression Bonding |
|
|
81 | (2) |
|
|
83 | (2) |
|
|
85 | (2) |
|
|
87 | (2) |
|
|
89 | (4) |
|
Bonding Automation and Optimization |
|
|
93 | (2) |
|
|
95 | (10) |
|
|
95 | (5) |
|
|
100 | (2) |
|
|
102 | (2) |
|
|
104 | (1) |
|
|
105 | (11) |
|
|
105 | (3) |
|
|
108 | (2) |
|
|
110 | (1) |
|
Higher Frequency Wirebonding |
|
|
110 | (5) |
|
|
115 | (1) |
|
|
116 | (5) |
|
|
116 | (1) |
|
|
116 | (5) |
|
Metallurgical Interconnections for Extreme High and Low Temperature Environments |
|
|
121 | (14) |
|
|
|
121 | (1) |
|
High Temperature Interconnections Requirements |
|
|
122 | (7) |
|
|
122 | (5) |
|
The Use of Flip Chips in HTE |
|
|
127 | (2) |
|
General Overview of Metallurgical Interfaces for Both HTE and LTE |
|
|
129 | (1) |
|
Low Temperature Environment Interconnection Requirements |
|
|
129 | (1) |
|
Corrosion and Other Problems in Both HTE, and LTE |
|
|
130 | (1) |
|
The Potential Use of High Temperature Polymers in HTE |
|
|
131 | (1) |
|
|
132 | (3) |
|
|
132 | (1) |
|
|
132 | (3) |
|
Design, Process, and Reliability of Wafer Level Packaging |
|
|
135 | (16) |
|
|
|
|
135 | (2) |
|
|
137 | (4) |
|
|
137 | (2) |
|
|
139 | (1) |
|
|
139 | (2) |
|
|
141 | (4) |
|
Challenges of Wafer Level Underfill |
|
|
142 | (1) |
|
Examples of Wafer Level Underfill Process |
|
|
143 | (2) |
|
Comparison of Flip-Chip and WLCSP |
|
|
145 | (1) |
|
Wafer Level Test and Burn-In |
|
|
145 | (4) |
|
|
149 | (2) |
|
|
149 | (2) |
|
Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow |
|
|
151 | (26) |
|
|
|
|
151 | (1) |
|
Design and Fabrication of Silicon Optical Bench with V-grooves |
|
|
152 | (6) |
|
Issues of Conventional Passive Alignment Methods |
|
|
158 | (4) |
|
V-grooves with Cover Plate |
|
|
158 | (3) |
|
|
161 | (1) |
|
Modified Passive Alignment Method |
|
|
162 | (6) |
|
|
162 | (1) |
|
|
163 | (1) |
|
|
164 | (1) |
|
|
164 | (1) |
|
|
165 | (3) |
|
Effects of Epoxy Viscosity and Dispensing Volume |
|
|
168 | (2) |
|
Application to Fiber Array Passive Alignment |
|
|
170 | (2) |
|
Conclusions and Discussion |
|
|
172 | (5) |
|
|
172 | (5) |
|
Reliability and Packaging |
|
|
|
Fundamentals of Reliability and Stress Testing |
|
|
177 | (26) |
|
|
More Performance at Lower Cost in Shorter Time-to-market |
|
|
178 | (2) |
|
Rapid Technological Developments |
|
|
178 | (1) |
|
Integration of More Products into Human Life |
|
|
178 | (1) |
|
Diverse Environmental Stresses |
|
|
178 | (1) |
|
|
179 | (1) |
|
|
179 | (1) |
|
|
179 | (1) |
|
|
180 | (4) |
|
|
180 | (1) |
|
Systems with Multiple Independent Failure Modes |
|
|
181 | (1) |
|
Failure Rate Distribution |
|
|
182 | (2) |
|
Failure Mechanisms in Electronics and Packaging |
|
|
184 | (2) |
|
Failure Mechanisms at Chip Level Include |
|
|
184 | (1) |
|
Failure Mechanisms at Bonding Include |
|
|
184 | (1) |
|
Failure Mechanisms in Device Packages Include |
|
|
185 | (1) |
|
Failure Mechanisms in Epoxy Compounds Include |
|
|
185 | (1) |
|
Failure Mechanisms at Shelf Level Include |
|
|
185 | (1) |
|
Failure Mechanisms in Material Handling Include |
|
|
185 | (1) |
|
Failure Mechanisms in Fiber Optics Include |
|
|
185 | (1) |
|
Failure Mechanisms in Flat Panel Displays Include |
|
|
186 | (1) |
|
Reliability Programs and Strategies |
|
|
186 | (1) |
|
Product Weaknesses and Stress Testing |
|
|
187 | (4) |
|
|
187 | (2) |
|
|
189 | (2) |
|
Stress Testing Formulation |
|
|
191 | (10) |
|
Threshold and Cumulative Stress Failures |
|
|
191 | (1) |
|
|
192 | (1) |
|
|
193 | (1) |
|
Lifetime Failure Fraction |
|
|
194 | (1) |
|
Robustness Against Maximum Service Life Stress |
|
|
195 | (2) |
|
|
197 | (1) |
|
|
198 | (3) |
|
|
201 | (2) |
|
How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests |
|
|
203 | (30) |
|
|
|
203 | (1) |
|
|
204 | (1) |
|
|
204 | (1) |
|
|
205 | (1) |
|
Reliability is a Complex Property |
|
|
206 | (1) |
|
Three Major Classes of Engineering Products and Market Demands |
|
|
206 | (2) |
|
Reliability, Cost and Time-to-Market |
|
|
208 | (1) |
|
|
208 | (1) |
|
Reliability Should Be Taken Care of on a Permanent Basis |
|
|
209 | (1) |
|
Ways to Prevent and Accommodate Failures |
|
|
210 | (1) |
|
|
211 | (1) |
|
|
211 | (1) |
|
|
212 | (1) |
|
|
212 | (1) |
|
|
213 | (1) |
|
|
213 | (1) |
|
Accelerated Life Tests (ALTs) |
|
|
214 | (1) |
|
Accelerated Test Conditions |
|
|
215 | (1) |
|
|
216 | (1) |
|
Accelerated Stress Categories |
|
|
217 | (1) |
|
Accelerated Life Tests (ALTs) and Highly Accelerated Life Tests (HALTs) |
|
|
218 | (1) |
|
Failure Mechanisms and Accelerated Stresses |
|
|
219 | (1) |
|
ALTs: Pitfalls and Challenges |
|
|
219 | (1) |
|
|
220 | (1) |
|
|
221 | (1) |
|
Non-Destructive Evaluations (NDE's) |
|
|
222 | (1) |
|
|
222 | (1) |
|
Some Accelerated Life Test (ALT) Models |
|
|
223 | (6) |
|
|
224 | (1) |
|
Boltzmann-Arrhenius Equation |
|
|
224 | (1) |
|
Coffin-Manson Equation (Inverse Power Law) |
|
|
225 | (1) |
|
|
226 | (1) |
|
|
227 | (1) |
|
|
227 | (1) |
|
|
227 | (1) |
|
Fatigue Damage Model (Miner's Rule) |
|
|
228 | (1) |
|
|
228 | (1) |
|
|
228 | (1) |
|
|
229 | (1) |
|
|
229 | (1) |
|
|
230 | (3) |
|
|
230 | (3) |
|
Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique |
|
|
233 | (20) |
|
|
|
|
233 | (1) |
|
Basics of Digital Image Correlation |
|
|
234 | (5) |
|
Cross Correlation Algorithms on Gray Scale Images |
|
|
234 | (2) |
|
Subpixel Analysis for Enhanced Resolution |
|
|
236 | (2) |
|
Results of Digital Image Correlation |
|
|
238 | (1) |
|
Displacement and Strain Measurements on SFM Images |
|
|
239 | (2) |
|
Digital Image Correlation under SPM Conditions |
|
|
239 | (2) |
|
Technical Requirements for the Application of the Correlation Technique |
|
|
241 | (1) |
|
Deformation Analysis on Thermally and Mechanically Loaded Objects under the SFM |
|
|
241 | (9) |
|
Reliability Aspects of Sensors and Micro Electro-Mechanical Systems (MEMS) |
|
|
241 | (1) |
|
Thermally Loaded Gas Sensor under SFM |
|
|
242 | (1) |
|
Crack Detection and Evaluation by SFM |
|
|
243 | (7) |
|
|
250 | (3) |
|
|
250 | (3) |
|
Interconnect Reliability Considerations in Portable Consumer Electronic Products |
|
|
253 | (46) |
|
|
|
|
253 | (2) |
|
Reliability---Thermal, Mechanical and Electrochemical |
|
|
255 | (12) |
|
|
255 | (2) |
|
|
257 | (1) |
|
|
257 | (7) |
|
Electrochemical Environment |
|
|
264 | (3) |
|
|
267 | (1) |
|
Reliability Comparisons in Literature |
|
|
267 | (4) |
|
Thermomechanical Reliability |
|
|
268 | (2) |
|
|
270 | (1) |
|
Influence of Material Properties on Reliability |
|
|
271 | (2) |
|
|
271 | (1) |
|
|
272 | (1) |
|
|
272 | (1) |
|
|
273 | (18) |
|
|
273 | (3) |
|
|
276 | (10) |
|
Electrochemical Environment |
|
|
286 | (5) |
|
reliability test Practices |
|
|
291 | (3) |
|
|
294 | (5) |
|
|
295 | (1) |
|
|
295 | (4) |
|
MEMS Packaging and Reliability |
|
|
299 | (24) |
|
|
|
299 | (5) |
|
Flip-Chip Assembly for Hybrid Integration |
|
|
304 | (5) |
|
Soldered Assembly for Three-Dimensional MEMS |
|
|
309 | (4) |
|
Flexible Circuit Boards for MEMS |
|
|
313 | (3) |
|
Atomic Layer Deposition for Reliable MEMS |
|
|
316 | (4) |
|
|
320 | (3) |
|
|
320 | (1) |
|
|
320 | (3) |
|
Advances in Optoelectronic Methodology for MOEMS Testing |
|
|
323 | (18) |
|
|
|
323 | (1) |
|
|
324 | (4) |
|
|
328 | (2) |
|
Optoelectronic Methodology |
|
|
330 | (4) |
|
Representative Applications |
|
|
334 | (4) |
|
Conclusions and Recommendations |
|
|
338 | (3) |
|
|
339 | (1) |
|
|
339 | (2) |
|
Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study |
|
|
341 | (20) |
|
|
|
High Efficiency Quantum Confined (Nanostructured) III-Nitride Based Light Emitting Diodes And Lasers |
|
|
342 | (6) |
|
|
342 | (6) |
|
Investigation of Reliability Issues in High Power Laser Diode Bar Packages |
|
|
348 | (9) |
|
|
348 | (1) |
|
Preparation of Packaged Samples for Reliability Testing |
|
|
349 | (1) |
|
Finding and Model of Reliability Results |
|
|
350 | (7) |
|
|
357 | (4) |
|
|
358 | (1) |
|
|
358 | (3) |
|
Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board |
|
|
361 | (22) |
|
|
|
|
|
|
|
|
Background to Optical Interconnects |
|
|
362 | (1) |
|
Transmission Equipment for Optical Interconnects |
|
|
362 | (3) |
|
Very Short Reach Optical Interconnects |
|
|
365 | (1) |
|
Free Space USR Optical Interconnects |
|
|
366 | (1) |
|
Guided Wave USR Interconnects |
|
|
367 | (3) |
|
Component Assembly of OECB's |
|
|
370 | (3) |
|
Computational Modeling of Optical Interconnects |
|
|
373 | (7) |
|
|
380 | (3) |
|
|
380 | (1) |
|
|
381 | (2) |
|
Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics |
|
|
383 | (20) |
|
|
|
383 | (2) |
|
Use of Adhesives in Micro and Opto-Electronic Assemblies |
|
|
383 | (1) |
|
|
384 | (1) |
|
|
385 | (8) |
|
General Properties of Adhesives |
|
|
385 | (5) |
|
|
390 | (3) |
|
|
393 | (8) |
|
|
393 | (4) |
|
|
397 | (4) |
|
|
401 | (2) |
|
|
401 | (1) |
|
|
401 | (1) |
|
|
401 | (1) |
|
|
401 | (1) |
|
|
402 | (1) |
|
|
402 | (1) |
|
Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials |
|
|
403 | (28) |
|
|
|
|
|
403 | (4) |
|
Multi-Stage Peel Test (MPT) |
|
|
407 | (6) |
|
|
407 | (1) |
|
|
408 | (1) |
|
Energy Variation in Steady State Peeling |
|
|
409 | (4) |
|
Interfacial Adhesion Strength of Copper Thin Film |
|
|
413 | (6) |
|
|
413 | (1) |
|
Measurement of Adhesion Strength by the MPT |
|
|
414 | (1) |
|
|
415 | (4) |
|
UV-Irradiation Effect on Ceramic/Polymer Interfacial Strength |
|
|
419 | (7) |
|
Preparation of PET/ITO Specimen |
|
|
419 | (3) |
|
Measurement of Interfacial Strength by MPT |
|
|
422 | (2) |
|
Surface Crack Formation on ITO Layer under Tensile Loading |
|
|
424 | (2) |
|
|
426 | (5) |
|
|
427 | (1) |
|
|
427 | (4) |
|
The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging |
|
|
431 | (42) |
|
|
|
|
432 | (1) |
|
Moisture Transport Behavior |
|
|
433 | (9) |
|
|
433 | (1) |
|
|
434 | (1) |
|
Underfill Moisture Absorption Characteristics |
|
|
435 | (3) |
|
Moisture Absorption Modeling |
|
|
438 | (4) |
|
Elastic Modulus Variation Due to Moisture Absorption |
|
|
442 | (7) |
|
|
442 | (2) |
|
Effect of Moisture Preconditioning |
|
|
444 | (3) |
|
Elastic Modulus Recovery from Moisture Uptake |
|
|
447 | (2) |
|
Effect of Moisture on Interfacial Adhesion |
|
|
449 | (24) |
|
|
449 | (2) |
|
Interfacial Fracture Testing |
|
|
451 | (1) |
|
Effect of Moisture Preconditioning on Adhesion |
|
|
452 | (9) |
|
Interfacial Fracture Toughness Recovery from Moisture Uptake |
|
|
461 | (1) |
|
Interfacial Fracture Toughness Moisture Degradation Model |
|
|
462 | (7) |
|
|
469 | (4) |
|
Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications |
|
|
473 | (14) |
|
|
|
|
473 | (1) |
|
Effect of the Interfacial Compliance on the interfacial Shearing Stress |
|
|
474 | (2) |
|
Internal Compressive Forces |
|
|
476 | (1) |
|
Advanced Nano-Particle Material (NPM) |
|
|
476 | (2) |
|
Highly-Compliant Nano-Systems |
|
|
478 | (1) |
|
|
479 | (8) |
|
|
480 | (1) |
|
Appendix 18.A: Bimaterial Assembly Subjected to an External Shearing Load and Change in Temperature: Expected Stress Relief due to the Elevated Interfacial Compliance |
|
|
480 | (3) |
|
Appendix 18.B: Cantilever Wire (``Beam'') Subjected at its Free End to a Lateral (Bending) and an Axial (Compressive) Force |
|
|
483 | (2) |
|
Appendix 18.C: Compressive Forces in the NPM-Based Compound Structure |
|
|
485 | (2) |
|
Adhesive Bonding of Passive Optical Components |
|
|
487 | (40) |
|
|
|
|
487 | (2) |
|
Optical Devices and Assemblies |
|
|
489 | (14) |
|
|
489 | (1) |
|
Opto-electronics Assemblies: Specific Requirements |
|
|
489 | (14) |
|
Adhesive Bonding in Optical Assemblies |
|
|
503 | (15) |
|
|
503 | (5) |
|
Adhesive Selection and Dispensing |
|
|
508 | (7) |
|
|
515 | (3) |
|
|
518 | (4) |
|
|
518 | (2) |
|
Planar Lightwave Circuit (PLC) Pigtailing |
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520 | (2) |
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Summary and Recommendations |
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522 | (5) |
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523 | (1) |
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523 | (4) |
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Electrically Conductive Adhesives: A Research Status Review |
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527 | (44) |
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527 | (2) |
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527 | (2) |
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Isotropic Conductive Adhesives (ICAs) |
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529 | (1) |
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Anisotropic Conductive Adhesives (ACAs) |
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529 | (1) |
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Non-Conductive Adhesive (NCA) |
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529 | (1) |
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529 | (5) |
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529 | (3) |
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532 | (2) |
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534 | (1) |
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534 | (4) |
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534 | (2) |
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536 | (1) |
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536 | (2) |
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538 | (8) |
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538 | (6) |
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544 | (1) |
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544 | (2) |
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546 | (7) |
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546 | (1) |
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547 | (6) |
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553 | (1) |
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553 | (1) |
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Maximum Current Carrying Capacity |
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553 | (1) |
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554 | (11) |
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554 | (3) |
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557 | (8) |
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565 | (1) |
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565 | (1) |
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565 | (6) |
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565 | (6) |
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Electrically Conductive Adhesives |
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571 | (40) |
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Introduction and Historical Background |
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571 | (3) |
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574 | (21) |
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Percolation and Critical Filler Content |
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574 | (1) |
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575 | (3) |
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578 | (17) |
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Aging Behavior and Quality Assessment |
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595 | (7) |
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595 | (1) |
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Material Selection and Experimental Parameters |
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595 | (2) |
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Curing Parameters and Definition of Curing Time |
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597 | (1) |
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Testing Conditions, Typical Results, and Conclusions |
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598 | (4) |
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About Typical Applications |
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602 | (5) |
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ICA for Attachment of Power Devices |
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602 | (2) |
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ICA for Interconnecting Parts with Dissimilar Thermal Expansion Coefficient |
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604 | (2) |
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ICA for Cost-Effective Assembling of Multichip Modules |
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606 | (1) |
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607 | (4) |
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Notations and Definitions |
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607 | (1) |
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608 | (3) |
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Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging |
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611 | (18) |
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611 | (2) |
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Isotropic Conductive Adhesives (ICAs) |
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613 | (6) |
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Improvement of Electrical Conductivity of ICAs |
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614 | (1) |
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Stabilization of Contact Resistance on Non-Noble Metal Finishes |
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615 | (3) |
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Silver Migration Control of ICA |
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618 | (1) |
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Improvement of Reliability in Thermal Shock Environment |
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618 | (1) |
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Improvement of Impact Performance of ICA |
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619 | (1) |
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Anisotropic Conductive Adhesives (ACAs)/Anisotropic Conductive Film (ACF) |
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619 | (4) |
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620 | (1) |
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Application of ACA/ACF in Flip Chip |
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621 | (1) |
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Improvement of Electrical Properties of ACAs |
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621 | (2) |
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Thermal Conductivity of ACA |
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623 | (1) |
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623 | (6) |
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Electrical Characteristics |
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623 | (1) |
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High Frequency Compatibility |
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623 | (1) |
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623 | (2) |
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ECAs with Nano-filler for Wafer Level Application |
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625 | (1) |
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625 | (4) |
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Die Attach Quality Testing by Structure Function Evaluation |
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629 | (22) |
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629 | (1) |
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629 | (1) |
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630 | (1) |
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630 | (1) |
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630 | (4) |
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Detecting Voids in the Die Attach of Single Die Packages |
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634 | (2) |
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Simulation Experiments for Locating the Die Attach Failure on Stacked Die Packages |
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636 | (6) |
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Simulation Tests Considering Stacked Dies of the Same Size |
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637 | (2) |
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Simulation Experiments on a Pyramidal Structure |
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639 | (3) |
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Verification of the Methodology by Measurements |
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642 | (7) |
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Comparison of the Transient Behavior of Stacked Die Packages Containing Test Dies, Prior Subjected to Accelerated Moisture and Temperature Testing |
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642 | (2) |
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Comparison of the Transient Behavior of Stacked Die Packages Containing Real Functional Dies, Subjected Prior to Accelerated Moisture and Temperature Testing |
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644 | (5) |
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649 | (2) |
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649 | (1) |
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650 | (1) |
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Mechanical Behavior of Flip Chip Packages under Thermal Loading |
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651 | (26) |
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651 | (1) |
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652 | (2) |
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654 | (2) |
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Phase Shifted Shadow Moire Method |
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654 | (1) |
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Electronic Speckle Pattern Interferometry (ESPI) Method |
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655 | (1) |
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Substrate CTE Measurement |
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656 | (5) |
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Behavior of Flip Chip Packages under Thermal Loading |
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661 | (7) |
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Warpage at Room Temperature |
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661 | (1) |
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Warpage at Elevated Temperatures |
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662 | (4) |
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Effect of Underfill on Warpage |
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666 | (2) |
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Finite Element Analysis of Flip Chip Packages under Thermal Loading |
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668 | (1) |
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Parametric Study of Warpage for Flip Chip Packages |
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669 | (5) |
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Change of the Chip Thickness |
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670 | (1) |
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Change of the Substrate Thickness |
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670 | (1) |
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Change of the Young's Modulus of the Underfill |
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671 | (1) |
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Change of the CTE of the Underfill |
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672 | (1) |
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Effect of the Geometry of the Underfill Fillet |
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672 | (2) |
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674 | (3) |
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674 | (3) |
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Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices |
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677 | (34) |
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Intrinsic Stress Due to Semiconductor Wafer Processing |
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677 | (8) |
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678 | (1) |
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679 | (2) |
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681 | (2) |
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Intrinsic Stress in Processed Wafer: Summary |
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683 | (2) |
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Die Stress Result from Flip-chip Assembly |
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685 | (13) |
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Consistent Composite Plate Model |
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685 | (2) |
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687 | (1) |
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Bimaterial Plate (BMP) Case |
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688 | (3) |
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Validation of the Bimaterial Model |
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691 | (4) |
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695 | (2) |
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Die Stress in Flip Chip Assembly: Summary |
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697 | (1) |
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Thermal Stress Due to Temperature Cycling |
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698 | (5) |
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698 | (1) |
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Constitutive Equation for Solder |
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699 | (1) |
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Time-Dependent Thermal Stresses of Solder Joint |
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700 | (1) |
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Solder Joint Reliability Estimation |
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701 | (2) |
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Thermal Stress Due to Temperature Cycling: Summary |
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703 | (1) |
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Residual Stress in Polymer-based Low Dielectric Constant (low-k) Materials |
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703 | (8) |
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708 | (3) |
Index |
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711 | |