About the editor |
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xv | |
Preface |
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xvii | |
1 Introduction: Power Electronics challenges |
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1 | (12) |
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1 | (1) |
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1.2 Power devices: the core of Power Electronics |
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2 | (3) |
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1.3 Wide-bandgap semiconductors |
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5 | (2) |
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7 | (1) |
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1.5 Temperature, reliability and other challenges |
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8 | (1) |
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9 | (1) |
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10 | (1) |
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10 | (3) |
2 Junction diodes |
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13 | (36) |
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13 | (1) |
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14 | (4) |
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2.2.1 Definition and types |
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14 | (1) |
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2.2.2 Equilibrium PN junction |
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15 | (1) |
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2.2.3 Nonequilibrium PN junction |
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16 | (1) |
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2.2.4 PN junction breakdown |
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17 | (1) |
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2.2.5 PN junction capacitance |
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18 | (1) |
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18 | (9) |
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2.3.1 Structures and operation principle |
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18 | (1) |
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2.3.2 Characteristics and parameters |
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19 | (3) |
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2.3.3 Typical application |
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22 | (1) |
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23 | (2) |
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25 | (2) |
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2.4 FRDs (fast recovery diodes) |
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27 | (8) |
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2.4.1 Structures and operation principle |
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27 | (4) |
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2.4.2 Characteristics and parameters |
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31 | (1) |
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2.4.3 Typical application |
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32 | (1) |
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33 | (2) |
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2.5 DSRDs (drift step recovery diodes) |
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35 | (8) |
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2.5.1 Structures and operation principle |
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35 | (3) |
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2.5.2 Characteristics and parameters |
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38 | (1) |
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2.5.3 Typical application |
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39 | (1) |
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40 | (3) |
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43 | (1) |
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44 | (1) |
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44 | (5) |
3 Thyristors |
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49 | (42) |
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49 | (3) |
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3.2 History and current state |
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52 | (2) |
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3.3 The thyristor structure and its two-transistor analogue |
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54 | (4) |
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3.4 Forward and reverse blocking |
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58 | (11) |
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3.4.1 Advanced methods for optimisation of blocking capability |
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62 | (3) |
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3.4.2 Junction termination |
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65 | (4) |
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3.5 Turn-on into the ON-state |
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69 | (7) |
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3.5.1 Turn on by the gate current IG |
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70 | (4) |
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3.5.2 Turn on by the light pulse |
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74 | (1) |
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3.5.3 Turn on by overcoming the break-over voltage VBO |
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75 | (1) |
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3.5.4 Turn on by a fast rise of the anode voltage (by overcoming the VBO at high dV/dt) |
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76 | (1) |
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76 | (5) |
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3.7 Serial and parallel connections |
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81 | (7) |
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3.7.1 Serial connection of thyristors |
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81 | (3) |
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3.7.2 Parallel connection of thyristors |
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84 | (4) |
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88 | (1) |
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88 | (1) |
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88 | (3) |
4 Silicon MOSFETs |
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91 | (22) |
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91 | (2) |
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93 | (10) |
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93 | (2) |
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4.2.2 The Superjunction principle |
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95 | (2) |
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4.2.3 Electric characteristics of Superjunction devices |
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97 | (6) |
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4.3 Low- and medium-voltage MOSFETs |
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103 | (6) |
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4.3.1 The vertical trench MOSFET versus the shielded-gate MOSFET |
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103 | (2) |
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4.3.2 Electric characteristic |
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105 | (4) |
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109 | (1) |
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109 | (1) |
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109 | (4) |
5 Silicon IGBTs |
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113 | (58) |
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113 | (1) |
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5.2 The IGBT structure, equivalent circuit and operation |
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114 | (2) |
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5.3 The IGBT static characteristics |
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116 | (2) |
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5.4 The IGBT switching characteristics |
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118 | (10) |
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121 | (5) |
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126 | (2) |
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5.5 The IGBT main requirements and structural evolution |
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128 | (8) |
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5.5.1 Losses reductions due to bulk optimisation |
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129 | (3) |
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5.5.2 Losses reductions due to MOS cell optimisation |
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132 | (4) |
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5.6 Short circuit and related instabilities in IGBTs |
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136 | (13) |
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5.6.1 Short-circuit turn-on transient |
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137 | (2) |
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5.6.2 Short-circuit turn-off transient |
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139 | (2) |
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5.6.3 Short circuit failure modes in IGBTs |
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141 | (1) |
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5.6.4 Analysis of IGBT short circuit failure modes II and II |
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142 | (3) |
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5.6.5 Short circuit oscillation phenomenon |
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145 | (4) |
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5.7 Safe operating area of IGBTs |
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149 | (7) |
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5.7.1 Dynamic avalanche and IGBT failure mode during turn-off |
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150 | (1) |
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5.7.2 IGBT turn-off under SOA conditions |
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151 | (4) |
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5.7.3 Switching self-clamp mode failure during turn-off |
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155 | (1) |
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5.8 IGBT development trends |
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156 | (9) |
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5.8.1 Increase in absolute power |
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156 | (5) |
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5.8.2 Increase in power density |
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161 | (4) |
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165 | (1) |
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166 | (1) |
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166 | (5) |
6 IGCTs |
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171 | (52) |
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171 | (1) |
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171 | (1) |
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172 | (1) |
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6.4 Gate turn-off thyristors (GTOs) |
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173 | (5) |
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178 | (3) |
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181 | (1) |
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182 | (2) |
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184 | (2) |
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186 | (7) |
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189 | (1) |
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189 | (1) |
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190 | (3) |
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6.10 Data-sheet parameters |
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193 | (11) |
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193 | (5) |
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198 | (6) |
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204 | (2) |
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206 | (4) |
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210 | (5) |
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6.13.1 IGCT VSIs and CSIs |
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210 | (2) |
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212 | (2) |
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6.13.3 Parallel connection |
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214 | (1) |
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215 | (1) |
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215 | (1) |
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216 | (1) |
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216 | (3) |
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219 | (1) |
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219 | (1) |
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220 | (3) |
7 Silicon carbide diodes |
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223 | (36) |
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223 | (1) |
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7.2 Review of silicon carbide SBD structures |
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224 | (8) |
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7.3 Edge termination and reverse bias reliability |
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232 | (5) |
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7.4 Measurement of application relevant parameters |
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237 | (8) |
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7.5 Operation in applications |
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245 | (5) |
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250 | (2) |
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7.7 Summary and further readings |
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252 | (1) |
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253 | (1) |
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253 | (6) |
8 SiC MOSFETs |
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259 | (36) |
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259 | (3) |
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8.2 Principle of operation |
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262 | (6) |
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263 | (2) |
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265 | (2) |
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8.2.3 Super junction MOSFET |
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267 | (1) |
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8.3 SiC/SiO2 interface challenge |
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268 | (2) |
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8.4 A comparison between Si MOSFET and SiC MOSFET |
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270 | (2) |
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8.5 Short circuit capability |
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272 | (14) |
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273 | (1) |
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8.5.2 Short-circuit failure mechanisms in SiC MOSFETs |
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274 | (8) |
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8.5.3 Short-circuit aging effect |
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282 | (2) |
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8.5.4 Short-circuit gate leakage current |
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284 | (2) |
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286 | (1) |
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287 | (1) |
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288 | (1) |
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288 | (7) |
9 GaN metal-insulator-semiconductor field-effect transistors |
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295 | (36) |
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9.1 Introduction: recent progress in GaN power devices and applications |
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295 | (4) |
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9.2 Principle of operation |
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299 | (5) |
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9.2.1 GaN-on-Si power transistor structures |
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299 | (1) |
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9.2.2 Normally-off GaN device technologies |
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299 | (3) |
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9.2.3 Challenges in GaN power transistors |
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302 | (2) |
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9.3 Gate instability and reliability |
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304 | (5) |
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9.3.1 Mechanisms of gate instability |
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304 | (2) |
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9.3.2 Characterization techniques |
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306 | (3) |
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9.3.3 Time-dependent dielectric breakdown |
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309 | (1) |
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309 | (12) |
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9.4.1 Dynamic ON-resistance (RoN) |
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309 | (6) |
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9.4.2 Characterization techniques |
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315 | (2) |
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9.4.3 Prospects and solutions |
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317 | (4) |
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321 | (1) |
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321 | (1) |
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321 | (10) |
10 Gallium nitride transistors: applications and vertical solutions |
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331 | (16) |
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331 | (1) |
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10.2 Advantages of GaN for power devices |
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331 | (2) |
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10.2.1 Material device and system-level benefit of GaN |
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332 | (1) |
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10.3 GaN applications and market trends |
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333 | (2) |
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10.3.1 Applications and market value |
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333 | (2) |
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335 | (2) |
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10.4.1 GaN heterostructure-based transistors |
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335 | (2) |
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10.5 Vertical GaN transistors |
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337 | (6) |
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10.5.1 Fabricated solutions for vertical and quasi-vertical GaN FETs |
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338 | (5) |
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343 | (1) |
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344 | (1) |
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344 | (3) |
11 Module design and reliability |
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347 | (38) |
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347 | (3) |
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11.2 Multi-physics design for power module |
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350 | (14) |
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11.2.1 EM simulation of power module |
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351 | (5) |
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11.2.2 EM-circuitry design in module packaging |
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356 | (1) |
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11.2.3 Thermal design and thermal analysis |
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357 | (5) |
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11.2.4 Thermal-mechanical design |
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362 | (2) |
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11.3 Enhancement of power module reliability |
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364 | (17) |
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11.3.1 Bonding materials and processes |
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365 | (8) |
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11.3.2 High insulation material and processes |
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373 | (4) |
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11.3.3 Electrical and reliability test |
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377 | (2) |
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379 | (2) |
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381 | (1) |
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381 | (1) |
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382 | (1) |
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382 | (3) |
12 Switching cell design |
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385 | (32) |
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385 | (3) |
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12.2 The concept for integrated switching cell |
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388 | (2) |
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390 | (3) |
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12.4 Electrical interfaces |
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393 | (2) |
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12.4.1 Insulation: clearance/creepage distances |
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393 | (2) |
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12.5 Mechanical interfaces |
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395 | (1) |
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396 | (4) |
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12.6.1 State-of-the-art DC link design |
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396 | (1) |
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12.6.2 DC link design for fast switching power modules |
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397 | (1) |
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12.6.3 Design rules for capacitor Csnubb |
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398 | (1) |
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12.6.4 Damping resistor Rsnubb design |
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398 | (2) |
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12.7 Layout considerations for fast switching applications |
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400 | (6) |
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12.7.1 Low inductive bus bar design |
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400 | (3) |
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403 | (2) |
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12.7.3 Gate drive path layout |
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405 | (1) |
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12.8 Alternative top side chip contact technologies |
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406 | (3) |
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406 | (2) |
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12.8.2 Metal clips and metallized transfer mold |
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408 | (1) |
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409 | (5) |
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12.9.1 IMS/PCB embedded GaN power module |
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410 | (2) |
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12.9.2 Full PCB SiC power module |
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412 | (2) |
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414 | (2) |
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416 | (1) |
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416 | (1) |
13 Modern insulated gate bipolar transistor (IGBT) gate driving methods for robustness and reliability |
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417 | (34) |
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417 | (2) |
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13.2 Operation principle of IGBTs |
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419 | (3) |
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13.3 Basic IGBT gate driving methods |
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422 | (3) |
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13.3.1 Voltage-source gate drivers |
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422 | (1) |
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13.3.2 Current-source gate drivers |
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423 | (1) |
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13.3.3 Optimization and protection principles |
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423 | (2) |
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13.4 Fault detection and protection methods |
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425 | (7) |
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13.4.1 Voltage and current overshoot |
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425 | (3) |
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13.4.2 Overload and short-circuit event |
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428 | (4) |
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13.4.3 Gate voltage limitations |
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432 | (1) |
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13.5 Active gating methods for enhancing switching characteristics |
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432 | (4) |
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13.5.1 Closed-loop control methodology |
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432 | (2) |
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13.5.2 Closed-loop control implementations |
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434 | (2) |
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13.6 Active thermal control methods using IGBT gate driver |
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436 | (9) |
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13.6.1 Principles for thermal mitigation method |
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436 | (1) |
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13.6.2 Thermal mitigation methods |
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437 | (3) |
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13.6.3 Junction temperature estimation methods |
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440 | (5) |
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445 | (1) |
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446 | (1) |
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446 | (1) |
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446 | (5) |
14 Prospects and outlooks in power electronics technology and market |
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451 | (18) |
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14.1 Global markets figures |
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451 | (2) |
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14.2 Impact of EV/HEV sector |
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453 | (3) |
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14.3 Wide-bandgap semiconductors |
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456 | (6) |
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456 | (3) |
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459 | (3) |
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14.4 Power packaging prospects |
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462 | (4) |
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14.4.1 Power discrete packaging market |
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463 | (1) |
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14.4.2 Power modules packaging market |
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464 | (2) |
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466 | (1) |
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466 | (1) |
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467 | (2) |
Index |
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