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1 | (4) |
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Multi-Carrier Technology and Carrier Interferometry: A Quantum Leap? |
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1 | (1) |
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2 | (3) |
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Overview of Multi-Carrier Technologies |
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5 | (36) |
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5 | (1) |
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Multi-Carrier Technologies: Past and Present |
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6 | (10) |
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6 | (2) |
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8 | (4) |
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12 | (4) |
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16 | (1) |
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The Carrier Interferometry (CI) Approach |
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16 | (7) |
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17 | (3) |
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Orthogonality Properties of the CI Signal |
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20 | (1) |
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Pseudo-Orthogonality Properties of CI Signals |
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21 | (2) |
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CI/MC-CDMA: The Application of the CI Signal to MC-CDMA |
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23 | (1) |
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CI/TDMA: Multi-Carrier Implementations of TDMA and the Demise of the Equalizer |
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24 | (5) |
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CI/DS-CDMA: A Multi-Carrier Implementation of DS-CDMA and the Demise of the RAKE receiver |
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29 | (4) |
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CI/OFDM: Increasing Performance and Throughput in OFDM and Eliminating the PAPR Problem |
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33 | (4) |
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37 | (4) |
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High-Performance High-Capacity MC-CDMA for Future Generations: The CI Approach |
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41 | (34) |
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42 | (2) |
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CI/MC-CDMA Signaling and Transmitter Model |
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44 | (5) |
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49 | (1) |
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50 | (2) |
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52 | (6) |
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52 | (1) |
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53 | (2) |
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55 | (3) |
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Crest Factor Considerations in CI/MC-CDMA |
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58 | (6) |
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60 | (1) |
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60 | (2) |
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62 | (2) |
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64 | (11) |
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Determining the Phases Minimizing Root Mean Square Correlation |
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65 | (1) |
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How to Generate Correlated Rayleigh Envelopes for Use in Simulations |
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66 | (3) |
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Derivation of MMSE Combiner in CI/MC-CDMA Receeiver |
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69 | (6) |
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High Performance, High Throughput TDMA via Multi-Carrier Implementations |
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75 | (14) |
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75 | (3) |
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75 | (2) |
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Overview of the CI Approach |
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77 | (1) |
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77 | (1) |
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78 | (3) |
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78 | (2) |
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CI Pulse Shapes for Doubling Throughput |
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80 | (1) |
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Bandwidth Efficiency of CI/TDMA |
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81 | (1) |
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81 | (1) |
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82 | (1) |
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83 | (4) |
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87 | (2) |
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High-Performance, High-Capacity DS-CDMA via Multicarrier Implementation |
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89 | (36) |
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90 | (1) |
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91 | (6) |
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91 | (2) |
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DS-CDMA Transmit and Receive Signal |
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93 | (4) |
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Novel Multi-carrier Chip Shapes and Novel Transmitters for DS-CDMA |
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97 | (4) |
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Novel Receiver Design for CI/DS-CDMA |
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101 | (4) |
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High-capacity DS-CDMA via Pseudo-Orthogonal CI Chip Shaping |
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105 | (3) |
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High Performance, High Capacity via a Second Pseudo-Orthogonal Chip Shaping |
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108 | (6) |
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114 | (2) |
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Characterizing Performance Gains and Network Capacity Improvements in CI/DS-CDMA |
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116 | (6) |
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122 | (3) |
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High-Performance, High-Throughput OFDM with Low PAPR via Carrier Interferometry Phase Coding |
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125 | (26) |
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125 | (2) |
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Novel CI Codes and OFDM Transmitter Structures |
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127 | (7) |
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127 | (4) |
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Addition of Pseudo-Orthogonality to CI/OFDM & CI/COFDM |
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131 | (3) |
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Novel OFDM Receiver Structures |
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134 | (2) |
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136 | (1) |
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137 | (3) |
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Peak to Average Power Ratio Considerations |
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140 | (7) |
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141 | (3) |
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144 | (3) |
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147 | (4) |
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The Marriage of Smart Antenna Arrays and Multi-Carrier Systems: Spatial Sweeping, Transmit Diversity, and Directionality |
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151 | (46) |
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Smart Antennas with Spatial Sweeping |
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153 | (9) |
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Proposed Antenna Array Structure |
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154 | (4) |
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Receiver Design for Smart Antenna with Spatial Sweeping |
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158 | (1) |
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159 | (3) |
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162 | (1) |
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Channel Modeling for Spatial Sweeping Smart Antennas: Establishing the Available Transmit Diversity |
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162 | (15) |
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Channel Model Assumptions |
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164 | (1) |
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Linear Time Varying Channel Impulse Response Modeling |
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165 | (4) |
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Evaluation of Coherence Time |
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169 | (1) |
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Updates to the Channel Impulse Response: Antenna Array Factor and Phase |
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170 | (7) |
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Innovative Combining of Multi-Carrier Systems and Smart Antennas with Spatial Sweeping |
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177 | (16) |
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179 | (2) |
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181 | (9) |
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190 | (3) |
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193 | (4) |
Index |
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197 | |