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E-grāmata: Optical Inspection of Microsystems, Second Edition

Edited by (Universitat Stuttgart, Germany)
  • Formāts: 584 pages
  • Izdošanas datums: 21-Jun-2019
  • Izdevniecība: CRC Press Inc
  • Valoda: eng
  • ISBN-13: 9780429532658
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  • Bibliotēkām
  • Formāts: 584 pages
  • Izdošanas datums: 21-Jun-2019
  • Izdevniecība: CRC Press Inc
  • Valoda: eng
  • ISBN-13: 9780429532658
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Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.

Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts.

Supplying effective tools for increased quality and reliability, this book











Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems





Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques





Offers numerous practical examples and illustrations





Includes calibration of optical measurement systems for the inspection of MEMS





Presents the characterization of dynamics of MEMS
Preface to Second Edition vii
Preface to First Edition ix
Editor xi
Contributors xiii
Chapter 1 Image Processing and Computer Vision for MEMS Testing
1(50)
Markus Hiittel
Chapter 2 Surface Features
51(22)
Xiangqian Jiang
Chapter 3 A Metrological Characteristics Approach to Uncertainty in Surface Metrology
73(20)
Richard Leach
Han Haitjema
Claudiu Giusca
Chapter 4 Image Correlation Techniques for Microsystems Inspection
93(46)
Dietmar Vogel
Bernd Michel
Chapter 5 Light Scattering Techniques for the Inspection of Microcomponents and Structures
139(16)
Angela Duparre
Sven Schroder
Chapter 6 Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)
155(22)
F. Michael Serry
Joanna Schmit
Chapter 7 Optical Profiling Techniques for MEMS Measurement
177(30)
Klaus Korner
Johann Krauter
Aiko Ruprecht
Tobias Wiesendanger
Chapter 8 Grid and Moire Methods for Micromeasurements
207(38)
Anand Asundi
Bing Zhao
Huimin Xie
Chapter 9 Grating (Moire) Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents
245(16)
Leszek Salbut
Malgorzata Kujawinska
Chapter 10 Interference Microscopy Techniques for Microsystem Characterization
261(36)
Alain Bosseboeuf
Philippe Coste
Sylvain Petitgrand
Chapter 11 Measuring MEMS in Motion by Laser Doppler Vibrometry
297(52)
Christian Rembe
Georg Siegmund
Heinrich Steger
Michael Wortge
Chapter 12 An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS
349(30)
Christophe Gorecki
Michal Jozwik
Patrick Delobelle
Chapter 13 Optoelectronic Holography for Testing Electronic Packaging and MEMS
379(26)
Cosme Furlong
Chapter 14 Digital Holography and Its Application in MEMS/MOEMS Inspection
405(80)
Wolfgang Osten
Pietro Ferraro
Chapter 15 Speckle Metrology for Microsystem Inspection
485(32)
Roland Hofling
Petra Aswendt
Chapter 16 Spectroscopic Techniques for MEMS Inspection
517(24)
Ingrid De Wolf
Chapter 17 Sensor Fusion in Multiscale Inspection Systems
541(22)
Marc Gronle
Index 563
Wolfgang Osten earned an MSc/Diploma in physics at Friedrich Schiller University Jena in 1979. From 1979 to 1984 he was a member of the Institute of Mechanics in Berlin, working in the field of experimental stress analysis and optical metrology. In 1983 he earned a PhD at the Martin Luther University Halle-Wittenberg for his thesis in the field of holographic interferometry. From 1984 to 1991 he was employed at the Central Institute of Cybernetics and Information Processes ZKI in Berlin, making investigations in digital image processing and computer vision. Between 1988 and 1991 he headed the Institute for Digital Image Processing at ZKI. From 1991 to 2002 he joined the Bremen Institute of Applied Beam Technology (BIAS) to establish and direct the Department of Optical 3D-Metrology. From September 2002 to October 2018 he was a full professor at the University of Stuttgart and director of the Institute for Applied Optics. From 2006 to 2010 he was the vice rector for research and technology transfer at Stuttgart University, and from 2015 to 2018 he was the vice chair of the university council. His research is focused on new concepts for industrial inspection and metrology by combining modern principles of optical metrology, sensor technology, and image processing. He directs special attention to the development of resolution-enhanced technologies for the investigation of micro- and nanostructures.