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E-grāmata: System-in-Package RF Design and Applications

  • Formāts: 240 pages
  • Izdošanas datums: 31-Jan-2006
  • Izdevniecība: Artech House Publishers
  • ISBN-13: 9781580539067
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System-in-Package RF Design and ApplicationsPalielināt
  • Formāts: 240 pages
  • Izdošanas datums: 31-Jan-2006
  • Izdevniecība: Artech House Publishers
  • ISBN-13: 9781580539067
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Practitioner Gaynor focuses on the practical as he describes this design method for complex wireless devices, combining solid information on RF components with state-of-the art packaging strategies. He covers the basic background and history of system-in-package (SiP) RF design, the addresses SiP substrate options, assembly processes, advanced packing techniques, system architecture issues and concerns, RF design and simulation, and advanced RF design techniques. He closes with a case study and thoughts on the field's future, which includes printable transistors and passives, new die interconnects, die-within-laminates, and high-power device packaging. Annotation ©2007 Book News, Inc., Portland, OR (booknews.com)
Preface xi
Acknowledgments xiii
Introduction
1(26)
Electronics Packaging History
3(3)
SiP Definition and Justification
6(2)
SoC Versus SiP
8(4)
SiP Designer Requirements
12(5)
RF Test and Known Good Die Test
17(1)
Reliability
18(9)
References
23(4)
SiP Substrate Options
27(28)
General LTCC Design Rules and Substrates
28(4)
Laminate General Design Rules and Substrates
32(5)
LTCC Versus Laminate
37(8)
LTCC Advantages
38(2)
Laminate Advantages
40(2)
Laminate New Technology
42(1)
LTCC New Technology
43(2)
MLF/QFN Design
45(1)
Other Substrates
45(3)
RF Design Philosophy Based on Substrate Type
48(2)
Thermal Characteristics
50(5)
References
52(3)
Assembly Process
55(30)
Assembly Process Flow
55(4)
Component Placement, Solderpaste, and Reflow
59(1)
Die Attach
60(8)
Wirebonding
68(6)
Die Protect/Encapsulation Characteristics
74(5)
Singulation
79(6)
References
81(4)
Advanced Packaging Techniques
85(30)
Shielding
85(5)
Antenna
90(2)
Embedded Passives
92(4)
Integrated Passive Network (IPN)
96(4)
Overmold LTCC
100(2)
Copper Pillar Bumping
102(4)
Stacked Die and Package on Package
106(2)
Discrete Components and IPNs in Leadframe
108(2)
Silicon Lid
110(5)
References
111(4)
System Architecture Issues/Concerns
115(18)
RX Direct Conversion
115(2)
Filtering
117(10)
General Layout Practices
127(6)
References
131(2)
RF Design and Simulation Tips
133(16)
Discrete and Embedded Component Modeling
134(8)
Via and Interconnect Models
142(2)
Test Techniques/Philosophy
144(5)
References
146(3)
Advanced RF Design Techniques
149(40)
Shortwave Coupler
149(4)
Broadband Matching
153(19)
Resonant Matching
154(13)
Subband Matching
167(5)
PIN Diode Switches
172(2)
Temperature Compensation Attenuators
174(3)
WLAN Filters in Laminate
177(3)
TX EVM with Power Control
180(4)
ESD Protection
184(5)
References
187(2)
A Case Study and Thoughts on the Field's Future
189(20)
Case Study
189(2)
Printable Transistors and Passives
191(7)
New Die Interconnect
198(2)
Die Within Laminate Solution
200(1)
High-Power Device Packaging
201(3)
Summary
204(5)
References
206(3)
Appendix 209(4)
About the Author 213(2)
Index 215


Michael P. Gaynor is RF technical director of the SiP Group at CEL in Wauconda, Illinois, where he is involved in all phases of projects enabling low-cost, small-size, high performance modules through architecture and circuit modification. Previously he was a senior staff RF development engineer with Motorola. He has 18 years of RF design experience and four years of RF SiP design experience. He holds several patents and has published several articles and papers on topics in the field.
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