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Systems, Software and Services Process Improvement: 30th European Conference, EuroSPI 2023, Grenoble, France, August 30 September 1, 2023, Proceedings, Part II 1st ed. 2023 [Mīkstie vāki]

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  • Formāts: Paperback / softback, 315 pages, height x width: 235x155 mm, weight: 528 g, 79 Illustrations, color; 17 Illustrations, black and white; XXV, 315 p. 96 illus., 79 illus. in color., 1 Paperback / softback
  • Sērija : Communications in Computer and Information Science 1891
  • Izdošanas datums: 30-Aug-2023
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3031423097
  • ISBN-13: 9783031423093
  • Mīkstie vāki
  • Cena: 69,22 €*
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  • Standarta cena: 81,44 €
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  • Formāts: Paperback / softback, 315 pages, height x width: 235x155 mm, weight: 528 g, 79 Illustrations, color; 17 Illustrations, black and white; XXV, 315 p. 96 illus., 79 illus. in color., 1 Paperback / softback
  • Sērija : Communications in Computer and Information Science 1891
  • Izdošanas datums: 30-Aug-2023
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3031423097
  • ISBN-13: 9783031423093
This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.

The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.  

SPI and Agile.- SPI and Standards and Safety and Security Norms.-
Sustainability and Life Cycle Challenges.- SPI and Recent
Innovations.- Virtual Reality and Augmented Reality.