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VLSI-SoC: Design for Reliability, Security, and Low Power: 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers 1st ed. 2016 [Hardback]

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  • Formāts: Hardback, 223 pages, height x width: 235x155 mm, weight: 4853 g, 121 Illustrations, black and white; XIII, 223 p. 121 illus., 1 Hardback
  • Sērija : IFIP Advances in Information and Communication Technology 483
  • Izdošanas datums: 13-Sep-2016
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 331946096X
  • ISBN-13: 9783319460963
  • Hardback
  • Cena: 46,91 €*
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  • Standarta cena: 55,19 €
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  • Formāts: Hardback, 223 pages, height x width: 235x155 mm, weight: 4853 g, 121 Illustrations, black and white; XIII, 223 p. 121 illus., 1 Hardback
  • Sērija : IFIP Advances in Information and Communication Technology 483
  • Izdošanas datums: 13-Sep-2016
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 331946096X
  • ISBN-13: 9783319460963
This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.