(Izdošanas datums: 27-Jan-2021, EPUB+DRM, Izdevniecība: Taylor & Francis Ltd, ISBN-13: 9780429863813)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Lasīt vairāk
(Izdošanas datums: 27-Jan-2021, PDF+DRM, Izdevniecība: Taylor & Francis Ltd, ISBN-13: 9780429863820)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Lasīt vairāk
(Izdošanas datums: 28-Mar-2018, PDF+DRM, Izdevniecība: Taylor & Francis Inc, ISBN-13: 9781351132503)
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aero...Lasīt vairāk
(Izdošanas datums: 28-Mar-2018, EPUB+DRM, Izdevniecība: Taylor & Francis Inc, ISBN-13: 9781351132497)
Improvements in safety in the air and in space can be achieved through better ergonomics, better work environments, and other efforts of traditional avionic psychology that directly affect human behaviors and performance. Not limited to just the aero...Lasīt vairāk
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucia...Lasīt vairāk
(Izdošanas datums: 04-Apr-2011, EPUB+DRM, Izdevniecība: John Wiley & Sons Inc, ISBN-13: 9780470886793)
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, et...Lasīt vairāk
(Izdošanas datums: 31-Mar-2011, PDF+DRM, Izdevniecība: John Wiley & Sons Inc, ISBN-13: 9780470886786)
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, et...Lasīt vairāk
(Izdošanas datums: 26-May-2007, PDF+DRM, Izdevniecība: Springer-Verlag New York Inc., ISBN-13: 9780387329895)
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the phys...Lasīt vairāk
