Atjaunināt sīkdatņu piekrišanu

Molecular Modeling and Multiscaling Issues for Electronic Material Applications: Volume 2 2015 ed. [Hardback]

Edited by , Edited by , Edited by , Edited by
  • Formāts: Hardback, 194 pages, height x width: 235x155 mm, weight: 4321 g, 77 Illustrations, color; 76 Illustrations, black and white; X, 194 p. 153 illus., 77 illus. in color., 1 Hardback
  • Izdošanas datums: 03-Dec-2014
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3319128612
  • ISBN-13: 9783319128610
Citas grāmatas par šo tēmu:
  • Hardback
  • Cena: 91,53 €*
  • * ši ir gala cena, t.i., netiek piemērotas nekādas papildus atlaides
  • Standarta cena: 107,69 €
  • Ietaupiet 15%
  • Grāmatu piegādes laiks ir 3-4 nedēļas, ja grāmata ir uz vietas izdevniecības noliktavā. Ja izdevējam nepieciešams publicēt jaunu tirāžu, grāmatas piegāde var aizkavēties.
  • Daudzums:
  • Ielikt grozā
  • Piegādes laiks - 4-6 nedēļas
  • Pievienot vēlmju sarakstam
  • Formāts: Hardback, 194 pages, height x width: 235x155 mm, weight: 4321 g, 77 Illustrations, color; 76 Illustrations, black and white; X, 194 p. 153 illus., 77 illus. in color., 1 Hardback
  • Izdošanas datums: 03-Dec-2014
  • Izdevniecība: Springer International Publishing AG
  • ISBN-10: 3319128612
  • ISBN-13: 9783319128610
Citas grāmatas par šo tēmu:
This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Molecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors
1(18)
Xianping Chen
Cell K.Y. Wong
Tianling Ren
Daoguo Yang
Junke Jiang
Qiuhua Liang
Guoqi Zhang
Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter
19(10)
Peng He
Haibo Fan
Matthew M.F. Yuan
Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly(vinylidene fluoride-co-trifluoroethylene) on Gold Substrate
29(12)
W. Hau
N. Iwamoto
H.B. Fan
G.D. Zhu
J. Wang
M.M.F. Yuen
Microelectronics Packaging Materials: Investigating the Influence of Moisture by Molecular Dynamics Simulations
41(26)
Ole Holck
Bernhard Wunderle
Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement
67(14)
Dawid Jan Krol
Artur Wymyslowski
Kamil Nouri Allaf
Using Coarse-Grained Molecular Models (Molecular-Mesoscale) of a Copper Oxide-Epoxy Interface to Obtain Stress--Strain Failure Predictions Which Include Interfacial Roughness, Water and Filler Effects
81(52)
Nancy E. Iwamoto
Establishment of the Mesoscale Parameters for Separation: A Nonequilibrium Molecular Dynamics Model
133(16)
Cell K.Y. Wong
S.Y.Y. Leung
R.H. Poelma
K.M.B. Jansen
C.C.A. Yuan
W.D. van Driel
G.Q. Zhang
Mechanics of Graphene and Carbon Nanotubes Under Uniaxial Compression and Tension
149(26)
R.H. Poelma
G.Q. Zhang
Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers
175
Sebastian J. Tesarski
Artur Wymyslowski
Kamil Nouri Allaf