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Precision Assembly Technologies and Systems: 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012, Proceedings 2012 ed. [Hardback]

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  • Formāts: Hardback, 212 pages, height x width: 235x155 mm, weight: 506 g, XII, 212 p., 1 Hardback
  • Sērija : IFIP Advances in Information and Communication Technology 371
  • Izdošanas datums: 17-Feb-2012
  • Izdevniecība: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3642281621
  • ISBN-13: 9783642281624
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  • Formāts: Hardback, 212 pages, height x width: 235x155 mm, weight: 506 g, XII, 212 p., 1 Hardback
  • Sērija : IFIP Advances in Information and Communication Technology 371
  • Izdošanas datums: 17-Feb-2012
  • Izdevniecība: Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • ISBN-10: 3642281621
  • ISBN-13: 9783642281624
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
Micro Assembly Processes and Systems
Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities
1(8)
Jacob W. Chesna
Stuart T. Smith
D.J. Hastings
Borja de la Maza
Bartoz K. Nowakowski
Feilong Lin
Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation
9(8)
James D. Claverley
Arne Burisch
Richard K. Leach
Annika Raatz
Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench
17(11)
J.F.C. van Gurp
Marcel Tichem
U. Staufer
Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment
28(8)
Jens Taprogge
Felix Beyeler
Alexander Steinecker
Bradley J. Nelson
Processes for the Self-assembly of Micro Parts
36(6)
Matthias Burgard
Norbert Schlafli
Uwe Mai
Precisely Assembled Multi Deflection Arrays - Key Components for Multi Shaped Beam Lithography
42(9)
Matthias Mohaupt
Erik Beckert
Thomas Burkhardt
Marcel Hornaff
Christoph Damm
Ramona Eberhardt
Andreas Tunnermann
Hans-Joachim Doring
Klaus Reimer
Handling and Manipulation in Assembly
Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications
51(6)
Andreas Hoch
Matthias Haag
Samuel Harer
Flexible Gripper System for Small Optical Assemblies - Final Tests and Findings
57(8)
Timo Prusi
Riku Heikkila
T.H. Ha
J. Y. Song
C. W. Lee
Reijo Tuokko
Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments
65(8)
Serena Ruggeri
Gianmauro Fontana
Claudia Pagano
Irene Fassi
Giovanni Legnani
Adhesive Workpiece Fixturing for Micromachining
73(8)
Philipp Blumenthal
Annika Raatz
Dual-Stage Feed Drive for Precision Positioning on Milling Machine
81(8)
Hendra Prima Syahputra
Hyeon Mo Yang
Byeong Mook Chung
Tae Jo Ko
High Resolution Actuators for Severe Environments
89(8)
Christian Belly
Mathieu Bagot
Frank Claeyssen
Tolerance Management and Error Compensation Methods
Tolerance Management for Assembly - Not a Matter of Product Size
97(8)
Rainer Muller
Martin Esser
Christian Janßen
Matthias Vette
Stefan Quinders
Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM
105(13)
Ali Rugbani
Kristiaan Schreve
Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach
118(8)
Christian Lochte
Jamal Kayasa
Christoph Herrmann
Annika Raatz
Metrology and Quality Control
Accuracy Measurements of Miniature Robot Using Optical CMM
126(8)
Asser Vuola
Reijo Tuokko
A System for the Quality Inspection of Surfaces of Watch Parts
134(10)
Giuseppe Zamuner
Jacques Jacot
Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding
144(10)
Rik Lafeber
Gerrit van den Bosch
Max Murre
Jitze Bassa
Leo van Moergestel
Erik Puik
Intelligent Control of Assembly Systems
Towards Intelligent Assembly and Manufacturing Environment - Modular ICT Support for Holonic Manufacturing System
154(9)
Minna Lanz
Eeva Jarvenpaa
Pasi Luostarinen
Fernando Garcia
Reijo Tuokko
Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data
163(12)
Konstantin Konrad
Michael Hoffmeister
Matthias Zapp
Alexander Verl
Johannes Busse
Accelerated Ramp-Up of Assembly Systems through Self-learning
175(8)
Robert Oates
Daniele Scrimieri
Svetan Ratchev
Process Selecting and Modelling Techniques
A Methodology for Assessing the Cost Effectiveness of Assembly Processes
183(8)
Kwabena Agyapong-Kodua
Svetan Ratchev
Model Based Planning of Complex Micro-manufacturing Strategies
191(9)
Daniel Zdebski
Shukri Afazov
Svetan Ratchev
Joel Segal
Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities
200(11)
Markus Dickerhof
Sabino Azcarate
Attila Temun
Author Index 211