Atjaunināt sīkdatņu piekrišanu

Semiconductor Microchips and Fabrication: A Practical Guide to Theory and Manufacturing [Hardback]

(University of Illinois, USA)
  • Formāts: Hardback, 320 pages, weight: 703 g
  • Izdošanas datums: 26-Sep-2022
  • Izdevniecība: Wiley-IEEE Press
  • ISBN-10: 1119867789
  • ISBN-13: 9781119867784
Citas grāmatas par šo tēmu:
  • Hardback
  • Cena: 130,80 €
  • Grāmatu piegādes laiks ir 3-4 nedēļas, ja grāmata ir uz vietas izdevniecības noliktavā. Ja izdevējam nepieciešams publicēt jaunu tirāžu, grāmatas piegāde var aizkavēties.
  • Daudzums:
  • Ielikt grozā
  • Piegādes laiks - 4-6 nedēļas
  • Pievienot vēlmju sarakstam
  • Bibliotēkām
  • Formāts: Hardback, 320 pages, weight: 703 g
  • Izdošanas datums: 26-Sep-2022
  • Izdevniecība: Wiley-IEEE Press
  • ISBN-10: 1119867789
  • ISBN-13: 9781119867784
Citas grāmatas par šo tēmu:
"This practical, yet advanced, book is written from the perspective of an engineer with many years' experience in the design and manufacturing of semiconductor microchips, and describes the process using the principles of physics and chemistry. The author believes that readers need to have a simple and practical book in their toolbox, and many former students have praised his approach as being invaluable to their onward career development. The explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms the world over, so readers will understand how the equipment works, and how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips. Through this book, readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them to better-understand and use semiconductor technology to improve their product quality or project research."--

Semiconductor Microchips and Fabrication

Advanced and highly illustrated guide to semiconductor manufacturing from an experienced industry insider

Semiconductor Microchips and Fabrication is a practical yet advanced book on the theory, design, and manufacturing of semiconductor microchips that describes the process using the principles of physics and chemistry, fills in the knowledge gaps for professionals and students who need to know how manufacturing equipment works, and provides valuable suggestions and solutions to many problems that students or engineers often encounter in semiconductor processing, including useful experiment results to help in process work.

The explanation of the semiconductor manufacturing process, and the equipment needed, is carried out based on the machines that are used in clean rooms over the world so readers understand how they can use the equipment to achieve their design and manufacturing ambitions. Combining theory with practice, all descriptions are carried out around the actual equipment and processes by way of a highly visual text, with illustrations including equipment pictures, manufacturing process schematics, and structures of semiconductor microchips.

Sample topics covered in Semiconductor Microchips and Fabrication include:

  • An introduction to basic concepts, such as impedance mismatch from plasma machines and theories, such as energy bands and Clausius-Clapeyron equation
  • Basic knowledge used in semiconductor devices and manufacturing machines, including DC and AC circuits, electric fields, magnetic fields, resonant cavity, and the components used in the devices and machines
  • Transistor and integrated circuits, including bipolar transistors, junction field effect transistors, and metal-semiconductor field effect transistors
  • The main processes used in the manufacturing of microchips, including lithography, metallization, reactive-ion etching (RIE), plasma-enhanced chemical vapor deposition (PECVD), thermal oxidation and implantation, and more
  • The skills in the design and problem solving of processes, such as how to design a dry etching recipe, and how to solve the micro-grass problems in Bosch process

Through Semiconductor Microchips and Fabrication, readers can obtain the fundamental knowledge and skills of semiconductor manufacturing, which will help them better understand and use semiconductor technology to improve their product quality or project research. Before approaching this text, readers should have basic knowledge of physics, chemistry, and circuitry.

Author Biography xi
Preface xiii
1 Introduction to the Basic Concepts
1(6)
1.1 What Is a Microchip?
1(1)
1.2 Ohm's Law and Resistivity
1(4)
1.3 Conductor, Insulator, and Semiconductor
5(2)
References
5(2)
2 Brief Introduction of Theories
7(10)
2.1 The Birth of Quantum Mechanics
7(4)
2.2 Energy Band (Band)
11(6)
References
15(2)
3 Early Radio Communication
17(6)
3.1 Telegraph Technology
17(2)
3.2 Electron Tube
19(4)
References
22(1)
4 Basic Knowledge of Electric Circuits (Circuits)
23(10)
4.1 Electric Circuits and the Components
23(3)
4.2 Electric Field
26(2)
4.3 Magnetic Field
28(2)
4.4 Alternating Current
30(3)
5 Further Discussion of Semiconductors and Diodes
33(14)
5.1 Semiconductor Energy Band
33(3)
5.2 Semiconductor Doping
36(6)
5.3 Semiconductor Diode
42(5)
References
46(1)
6 Transistor and Integrated Circuit
47(14)
6.1 Bipolar Transistor
47(2)
6.2 Junction Field Effect Transistor
49(3)
6.3 Metal-Semiconductor Field Effect Transistor
52(3)
6.4 Metal-Insulator-Semiconductor Field Effect Transistor
55(6)
References
60(1)
7 The Development History of Semiconductor Industry
61(16)
7.1 The Instruction of Semiconductor Products and Structures
61(2)
7.2 A Brief History of the Semiconductor Industry
63(2)
7.3 Changes in the Size of Transistors and Silicon Wafers
65(2)
7.4 Clean Room
67(4)
7.5 Planar Process
71(6)
References
75(2)
8 Semiconductor Photonic Devices
77(20)
8.1 Light-Emitting Devices and Light-Emitting Principles
77(5)
8.2 Light-Emitting Diode (LED)
82(6)
8.3 Semiconductor Diode Laser
88(9)
8.3.1 Resonant Cavity
89(2)
8.3.2 Reflection and Refraction of Light
91(2)
8.3.3 Heterojunction Materials
93(1)
8.3.4 Population Inversion and Threshold Current Density
94(2)
References
96(1)
9 Semiconductor Light Detection and Photocell
97(12)
9.1 Digital Camera and CCD
97(3)
9.2 Photoconductor
100(1)
9.3 Transistor Laser
101(4)
9.4 Solar Cell
105(4)
References
106(3)
10 Manufacture of Silicon Wafer
109(16)
10.1 From Quartzite Ore to Polysilicon
110(3)
10.2 Chemical Reaction
113(2)
10.3 Pull Single Crystal
115(1)
10.4 Polishing and Slicing
116(9)
References
123(2)
11 Basic Knowledges of Process
125(10)
11.1 The Structure of Integrated Circuit (IC)
125(3)
11.2 Resolution of Optical System
128(3)
11.3 Why Plasma Used in the Process
131(4)
References
133(2)
12 Photolithography (Lithography)
135(26)
12.1 The Steps of Lithography Process
135(17)
12.1.1 Cleaning
135(1)
12.1.2 Dehydration Bake
136(2)
12.1.3 Photoresist Coating
138(3)
12.1.4 Soft Bake
141(1)
12.1.5 Alignment and Exposure
141(4)
12.1.6 Developing
145(1)
12.1.7 Inspection
146(1)
12.1.8 Hard Bake
147(1)
12.1.9 Descum
148(4)
12.2 Alignment Mark (Mark) Design on the Photomask
152(4)
12.3 Contemporary Photolithography Equipment Technologies
156(5)
References
159(2)
13 Dielectric Films Growth
161(18)
13.1 The Growth of Silicon Dioxide Film
162(6)
13.1.1 Thermal Oxidation Process of SiO2
162(2)
13.1.2 LTO Process
164(2)
13.1.3 PECVD Process of Silicon Dioxide
166(1)
13.1.4 TEOS + O3 Deposition Using APCVD System
167(1)
13.2 The Growth of Silicon Nitride Film
168(6)
13.2.1 LPCVD
168(3)
13.2.2 PECVD Process of Silicon Nitride
171(3)
13.3 Atomic Layer Deposition Technique
174(5)
References
177(2)
14 Introduction of Etching and RIE System
179(18)
14.1 Wet Etching
179(3)
14.2 RIE System for Dry Etching
182(15)
14.2.1 RIE Process Flow and Equipment Structure
182(2)
14.2.2 Process Chamber
184(2)
14.2.3 Vacuum Pumps
186(1)
14.2.4 RF Power Supply (Source) and Matching Network (Matchwork)
187(2)
14.2.5 Gas Cylinder and Mass Flow Controller (MFC)
189(5)
14.2.6 Heater and Coolant
194(2)
References
196(1)
15 Dry Etching
197(28)
15.1 The Etch Profile of RIE
197(6)
15.1.1 Case 1
198(3)
15.1.2 Case 2
201(2)
15.2 Etching Rate of RIE
203(3)
15.3 Dry Etching of III--V Semiconductors and Metals
206(1)
15.4 Etch Profile Control
207(4)
15.4.1 Influence of the PR Opening Shape on the Etch Profile
208(1)
15.4.2 The Effect of Carbon on Etching Rate and Profile
209(2)
15.5 Other Issues
211(4)
15.5.1 The Differences Between RIE and PECVD
211(3)
15.5.2 The Difference Between Si and SiO2 Dry Etching
214(1)
15.6 Inductively Coupled Plasma (ICP) Technique and Bosch Process
215(10)
15.6.1 Inductively Coupled Plasma Technique
216(3)
15.6.2 Bosch Process
219(4)
References
223(2)
16 Metal Processes
225(20)
16.1 Thermal Evaporation Technique
225(2)
16.2 Electron Beam Evaporation Technique
227(4)
16.3 Magnetron Sputtering Deposition Technique
231(3)
16.4 The Main Differences Between Electron Beam (Thermal) Evaporation and Sputtering Deposition
234(1)
16.5 Metal Lift-off Process
235(6)
16.6 Metal Selection and Annealing Technology
241(4)
16.6.1 The Selection of Metals
241(1)
16.6.2 Metal Annealing
242(1)
References
243(2)
17 Doping Processes
245(26)
17.1 Basic Introduction of Doping
245(1)
17.2 Basic Principles of Diffusion
246(1)
17.3 Thermal Diffusion
247(1)
17.4 Diffusion and Redistribution of Impurities in SiO2
248(2)
17.5 Minimum Thickness of SiO2 Masking Film
250(1)
17.6 The Distribution of Impurities Under the SiO2 Masking Film
251(1)
17.7 Diffusion Impurity Sources
252(3)
17.8 Parameters of the Diffusion Layer
255(1)
17.9 Four-Point Probe Sheet Resistance Measurement
256(1)
17.10 Ion Implantation Process
257(2)
17.11 Theoretical Analysis of Ion Implantation
259(1)
17.12 Impurity Distribution after Implantation
260(2)
17.13 Type and Dose of Implanted Impurities
262(1)
17.14 The Minimum Thickness of Masking Film
263(1)
17.15 Annealing Process
264(2)
17.16 Buried Implantation
266(5)
17.16.1 Implantation through Masking Film
266(1)
17.16.2 SOI Manufacture
267(3)
References
270(1)
18 Process Control Monitor, Packaging, and the Others
271(24)
18.1 Dielectric Film Quality Inspection
271(2)
18.2 Ohmic Contact Test
273(1)
18.3 Metal-to-Metal Contact
274(3)
18.4 Conductive Channel Control
277(1)
18.5 Chip Testing
278(1)
18.6 Dicing
279(1)
18.7 Packaging
280(1)
18.8 Equipment Operation Range
281(1)
18.9 Low-k and High-k Dielectrics
282(9)
18.9.1 Copper Interconnection and Low-k Dielectrics
283(3)
18.9.2 Quantum Tunneling Effect and High-k Dielectrics
286(5)
18.10 End
291(4)
References
293(2)
Index 295
Mr. Yaguang Lian is a Research Engineer at Holonyak Micro & Nanotechnology Lab, the University of Illinois, USA. In his twenty years of working, he has trained thousands of students in using the manufacturing machines. Before Mr. Lian came to the USA, he worked at the Hebei Semiconductor Research Institute (HSRI), China, for over 13 years. At HSRI, he oversaw the entire manufacturing process line, from implantation to packaging, in addition to IC design work. Working in the field of semiconductors for over 30 years, Mr. Lian deeply understands the key points of the manufacturing process and has a profound knowledge on both theory and equipment.